For the problems of low recognition rate and slow recognition speed of traditional detection methods in IC appearance defect detection, we propose an IC appearance defect detection algo-rithm IH-ViT. Our proposed model takes advantage of the respective strengths of CNN and ViT to acquire image features from both local and global aspects, and finally fuses the two features for decision making to determine the class of defects, thus obtaining better accuracy of IC defect recognition. To address the problem that IC appearance defects are mainly reflected in the dif-ferences in details, which are difficult to identify by traditional algorithms, we improved the tra-ditional ViT by performing an additional convolution operation inside the batch. For the problem of information imbalance of samples due to diverse sources of data sets, we adopt a dual-channel image segmentation technique to further improve the accuracy of IC appearance defects. Finally, after testing, our proposed hybrid IH-ViT model achieved 72.51% accuracy, which is 2.8% and 6.06% higher than ResNet50 and ViT models alone. The proposed algorithm can quickly and accurately detect the defect status of IC appearance and effectively improve the productivity of IC packaging and testing companies.
翻译:对于在IC外观缺陷检测中发现传统探测方法的低识别率和缓慢识别速度的问题,我们建议采用IC外观缺陷检测 algo-rithm IH-ViT。我们提议的模型利用CNN和ViT各自的长处,从当地和全球两个方面获得图像特征,最后结合了确定IC的缺陷类别的两个决策特征,从而提高IC的缺陷识别准确度。为了解决IC外观缺陷主要反映在细节的偏差中的问题,这些偏差很难通过传统算法来识别,我们通过在批量内进行额外的演动操作改进了Tradition VIT。对于由于数据集来源不同而造成的样本信息不平衡问题,我们采用了双通道图像分割技术,以进一步提高IC外观缺陷的准确性。最后,我们提议的混合IH-ViT模型在测试后达到了72.51%的准确度,比ResNet50和ViT模型高出2.8%和6.06%。拟议的算法可以快速准确地检测IC外观的缺陷,并有效地改进IC包装公司的生产率。