功率系统的三维集成技术研究

项目名称： 功率系统的三维集成技术研究

项目编号： No.61464002

项目类型： 地区科学基金项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 杨发顺

作者单位： 贵州大学

项目金额： 48万元

中文摘要： 功率系统是包含低压低功耗模块和高压大电流器件的复杂电路系统。功率容量和转换效率是其两个关键的技术指标。功率集成技术是实现其小型化、智能化和高可靠性的有效手段。目前主流的功率集成技术受到高低兼容、高低压隔离等因素的限制，功率集成系统的功率密度、转换效率和可靠性较难同时兼顾。本项目以大功率器件和各功能芯片的三维叠层技术、各层间的三维互连结构以及芯片内部散热技术为研究重点，展开对三维功率半导体集成技术的研究。研究内容包括三维功率集成工艺设计，适用于三维集成的大功率器件芯片和附属功能模块芯片的制作，TSV实现的层间互连技术，三维集成的功率系统热可靠性设计。用TSV实现芯片内部和叠层功率芯片的嵌套式散热网络，兼顾绝缘和最小热阻的热疏导复合结构，形成有效的热疏导系统，打破常规集成工艺中相关因素的限制，提高功率系统的功率密度、转换效率和可靠性。项目成果将推动功率集成技术和绿色电子技术的进步。

中文关键词： 功率系统；三维集成；多层键合；三维互连；嵌套式散热网络

英文摘要： Power system is quite complex, because there are high voltage power devices and low voltage modules such as driver, sensing and protection circuits, and interface circuits in it. The most important specifications for power system is the conversion efficiency and the power capability. Power integration technology is an effective means to achieve goals,such as miniaturization, intelligence and high reliability. At present, limited by the compatibility of integration process and complex isolation structures, it is difficult to improve performance, power density and conversion efficiency at the same time. To eliminate the limits in traditional power integration technology, three-dimensional integration by mutiple layer bonding technology is proposed. The research work will mainly focus on bonding technology, three-dimensional interconnection structure, and the design and implementation of the embedded heat conduction network.To increse power density,vetical power devices will be stacked in more than two layers. Three-dimensional interconnection is realized by the TSV. The thermal conduction network is implemented by metal and deliberately designed compound barrier structure in TSV. By the network overlaying chips will be arranged in a reasonable position to form an effective cooling system. The results of the project will contribute to the progress of power integration technology and green electronics.

英文关键词： Power system;Three-dimensional integration;Bonding of muti-layers;Three-dimensional interconnetion;Embedded heat conduction network