基于复合弹性研抛盘的非晶薄膜衬底分级研抛新方法研究

项目名称： 基于复合弹性研抛盘的非晶薄膜衬底分级研抛新方法研究

项目编号： No.51205358

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 机械工程学科

项目作者： 金明生

作者单位： 浙江工业大学

项目金额： 25万元

中文摘要： 针对非晶薄膜衬底少、无损伤，超光滑和高精度表面的加工需求，提出基于复合弹性研抛盘的分级研抛新方法，其原理和创新是：将磨粒弹性固结于复合弹性研抛盘，利用复合弹性层的力学性能，形成对磨粒的弹性支撑和柔性力学行为约束，实现磨粒与衬底的软性接触；采用吸水高聚物实现研抛盘的溶胀磨削脱落自修整功能，保证衬底平面度，延长研抛盘使用寿命；利用表面分级设计，在一个研抛盘上实现研磨和抛光工序的连续衔接；利用结构化流道，改善研抛盘上液固两相的流动性能等；利用自动化控制，实时调控衬底与研抛盘之间的接触压力和相对运动速度等，进行多目标工艺实验，以期在获得衬底加工精度和超光滑表面的同时，有效减少其表层亚表层的损伤和残余应力等。本项目的研究对促进非晶态材料和光伏技术的发展，丰富超精密加工理论，特别是非晶薄膜衬底的相关加工理论和技术，具有重要的现实意义，对光学元件、半导体材料的超精密加工也有一定的指导和应用意义。

中文关键词： 复合弹性；非晶薄膜衬底；分级研抛；加工工艺；原型系统

英文摘要： According to the process needs of amorphous thin-film substrate, such as less and no damage, ultra-smooth and high accurate, a new grading lapping and polishing method based on composite elastic disk was proposed. The following is the principle and innovation of this new method. The abrasive particles are elastic consolidated in the composite elastic disk. The mechanical properties of the composite elastic help to form the elastic support and mechanical behavior constraints of the abrasive particles and achieve the soft contact between abrasive and substrate. Realize the self-conditioning of the grading lapping and polishing disk due to the materials swelling and fall off in the processing by make use of the water absorption polymer. It ensures the substrate flatness and extends the life of the disk. Because of the grading design of the composite elastic disk surface, grinding and polishing process can be continuously done in one disk. The use of the structured flow passage improves the liquid-solid flow properties. Apply the automation control, the contact pressure, relative velocity and other parameters between the substrate and the disk can be actively controlled. As well as, carrying out multi-objective process experiments to effectively reduce the subsurface damage and residual stress, and obtain the proces

英文关键词： composite elastic；amorphous thin-film substrate；grading lapping and polishing；processing technic；prototype system