新型介质集成悬置线前端电路与系统

项目名称： 新型介质集成悬置线前端电路与系统

项目编号： No.61471092

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 马凯学

作者单位： 电子科技大学

项目金额： 86万元

中文摘要： 本项目将对申请人获得美国专利中提出的新型介质集成悬置线高品质小型化电路与系统进行理论研究和工程实现。运用商用多层高频印制电路板（PCB）或多层低温共烧陶瓷（LTCC）等材料和加工工艺，引入介质集成悬置线这一全新的多层自封装传输结构，以把微波毫米波前端电路如滤波器，混频器，压控振荡器等全部集成于介质集成悬置线为核心的多层设计平台上。研制出具有体积小、成本低、可靠性好、高集成化程度、自封装等优点的新型微波毫米波前端系统。这也将使基于该技术设计的多芯片MCM具备高品质自封装的优点。它的研究将在前端电路与系统方面开辟一个新的领域，从而推动该技术实现的前端电路与系统在军事和民用的广泛应用，为我国现代国防通信雷达等前端系统开辟新的设计实现手段。由于这种多层结构的新颖性、高性能、自封装、小型化、低成本和高集成度等特性，而且适于大规模生产, 其发展前景十分看好, 可望在军用和民用方面取得显著成效。

中文关键词： 介质集成悬置带线；多层立体集成；非平面/平面传输线融合技术；多芯片微组装技术；微波毫米波电路

英文摘要： This project will do theoretical study and engineering realization of new substrate integrated suspended lines, high-quality, miniaturized electronic circuit and system, which was proposed in the granted American patent by the applicant. Utilize the popular multilayer high frequency printed circuit board(PCB) or multilayer low temperature co-fired ceramic(LTCC) materials and processing technics, and introduce the new multilayer self-packaging transmission structure, so as to integrate microwave and millimeter wave front-end circuits such as filters, mixers, and voltage controlled oscillator, etc. in the multilayer design platform, where the core is substrate integrated suspended lines. Develop new microwave and millimeter wave front-end systems, which have advantages such as small size, low cost, high reliability, high integration, self-packaging and so on. Multichip module(MCM) designed based on this technology will have the advantage of high quality and self-packaging. This research will provide a new approach for front-end circuits and systems, thus promote front-end circuits and systems based on this technology to be widely used in military and civil activities, modern national defense communication,radar etc.of our country. Due to the novelty, high performance, self-packaging, miniaturization, low cost and high integration, etc. of this multilayer approach, it has high poential for low cost and mass production in future. With good prospects of this development, remarkable resuits will be obtained in military and civil applications.

英文关键词： Substrate Integrated Suspended lines;Multilayer Three Dimensional Integration;Nonplanar/Planar Transmission Line Fusion Technology;Multichip Module and Microcircuit Packaging Technology;Microwave & mm-wave circuits