宽带硅基三维光电集成关键技术的基础研究

项目名称： 宽带硅基三维光电集成关键技术的基础研究

项目编号： No.61306136

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 无线电电子学、电信技术

项目作者： 刘丰满

作者单位： 中国科学院微电子研究所

项目金额： 26万元

中文摘要： 三维集成可以有效缩短连线长度、降低功耗、提高性能并能提供异质器件集成；光传输具有传输速度快、功耗低以及不受互连I/O密度限制等优势，二者结合能有效实现高速光子-电子器件小型化、高带宽以及低能耗。本项目拟开展宽带、紧凑型、高可靠性三维光电集成基础技术研究：为实现单通道大于25Gbps的宽带传输，研究高速光信号在各种光波导中的延迟、衰减与畸变现象，多模和单模模式转换中的模式耦合、光场衰减与模班匹配，分析各种光学结构对传输带宽的影响；研究TSV及相关互连结构电学模型，研究微波互连泄漏、损耗以及屏蔽，分析互连对有源器件的带宽影响，研究带宽扩展技术；为实现超紧凑的光电集成，研究有源器件与无源结构的高效耦合、微光元件集成技术；优化光电集成结构，缩小器件尺寸；为实现稳定的传输系统，研究电子和光子集成系统功耗以及散热管理，掌握光电信号同传转接板和光电子异质集成的关键制造工艺，实现多个功能器件的准单片集成。

中文关键词： 光电集成；光电组装；转接板；光学耦合；信号完整性

英文摘要： Three-dimensional (3D) integration can effectively reduce the interconnect length reduce power consumption, improve performance and support heterogeneous devices integration. Optical interconnection is superior to copper interconnect based on fast transmission speed, low power consumption and unlimited to interconnect length and I/O density. Therefore, combined 3D IC and optical interconnect, high-speed, device miniaturization and low power consumption can be effectively achieved. This project focuses on the development of high bandwidth, compact and reliable 3D optoelectronics integration. To realize the broadband transmission with single channel beyond 25Gbps, study on the delay, loss and distortion of the high-speed optical signal in various optical waveguide, and mode coupling, photon field enhancement and attenuation principle in the conversion between multi-mode and single mode, and the impact of optical structure on the transmission bandwidth will be performed. Moreover, some research on the electrical model of TSV and related interconnection structure, the interconnection impact on the active device, bandwidth extension technology, the effective coupling between active and passive devices and integration technology of micro-optical element, the leakage, loss and shielding of the microwave interconnection

英文关键词： optoelectronics integration；optoelectronics package；interposer；optical coupling；signal integrity