基于全波去嵌法的三维层叠结构射频元器件联合建模技术研究

项目名称： 基于全波去嵌法的三维层叠结构射频元器件联合建模技术研究

项目编号： No.61471240

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 金荣洪

作者单位： 上海交通大学

项目金额： 83万元

中文摘要： SIP（系统级封装）和SOP（封装上的系统）技术对射频前端的小型化具有重要意义，三维层叠在其中起到了关键作用。然而，三维层叠中的电路仿真却是一个颇具挑战性的难题，需要从改进元器件建模方法的角度出发寻找解决途径。近年来提出的全波去嵌法提供了一个很好的思路，基于全波去嵌法的建模技术具有独特优势，有望成为解决问题的突破口。基于以上考虑，本项目首先研究全波去嵌法的基本特性及其误差分析与误差控制方法，为将该方法拓展到三维层叠等新领域奠定坚实的理论基础。在此基础上，基于全波去嵌法和经典的模型提取方法，提出一种新的联合建模技术，深入研究其原理并进行实验验证。最后，利用联合建模技术获得射频元器件模型，并基于SIP或SOP设计完整的射频前端，通过实验验证联合建模技术应用于三维层叠电路仿真的有效性。

中文关键词： 三维层叠；联合建模；射频元器件；全波去嵌法

英文摘要： The system-in-package (SIP) and system-on-package (SOP) technologies, where 3D stacking plays a crucial role, are of great significance in the miniaturization of RF front-ends. However, accurate circuit simulations are very difficult to achieved in 3D-stacking architecture, since existing modeling techniques for circuit components are of low accuracy in this case. A recently proposed method for RF measurment, the full-wave de-embedding method,can improve the modeling techniques and help to find a solution to this problem. Based on the above consideration, this project will study the fundamentals, error analysis and error control of the full-wave de-embedding method, and apply the results to the case of 3D stacking. Further, a novel co-modeling technique will be proposed based on the full-wave de-embedding method, and its principle will be studied in depth and verified through experiments. Finally, fully functional RF front-ends based on SIP or SOP technologies will be designed and simulated, using the component models obtained by the co-modeling technique. Experiments of the front-ends will be also carried out in order to proof the effectiveness of the proposed co-modeling technique in 3D stacking architecture.

英文关键词： 3D stacking;co-modeling;RF devices;full-wave de-embedding method