基于多电压的三维集成电路布局规划研究

项目名称： 基于多电压的三维集成电路布局规划研究

项目编号： No.61501268

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 无线电电子学、电信技术

项目作者： 储著飞

作者单位： 宁波大学

项目金额： 23万元

中文摘要： 三维集成电路(3D-ICs)通过硅通孔(TSV)实现芯片层垂直方向上的堆叠，缩短了互连线长度、提升了芯片的集成度和性能，成为未来集成电路的重点发展方向。但芯片堆叠会使得功率密度大幅增加，带来的局部热效应是影响3D-ICs可靠性和应用所面临的最大难题。基于多电压的低功耗技术是解决这一难题的有效途径之一。针对多电压3D-ICs在布局规划阶段面临的设计挑战，本项目的主要研究内容如下：针对3D-ICs物理结构和热效应进行建模，提出多电压分配算法并结合布局规划实现协同优化算法；研究布局规划过程中的空白面积管理方法，发展时序和物理约束下的电平移位器规划算法；研究3D-ICs的电源/地(P/G)供电网络模型，提出电压降驱动的多电压3D-ICs供电引脚配置和P/G TSV布局方法；建立实验验证平台验证所提出方法的有效性。课题的开展将会为3D-ICs设计提供科学指导和技术支撑，具有重要的理论价值和应用前景。

中文关键词： 版图设计；设计优化；优化算法；EDA

英文摘要： Three dimensional integrated circuits (3D-ICs) are realized by stacking several chips/dies vertically based on through-silicon vias (TSVs). The reduced wirelength can improve both the integration density and the performance. Therefore, it is considered to be most promising for advanced ICs development. However, the stacked chips/dies will cause higher power density compared to 2D-ICs. The resulted local heating effect is acknowledged as the most critical challenges for the reliability and applicability of 3D-ICs. The multiple-supply-voltages (MSVs) based low power design technique is one of the effective methods to solve this problem. Regarding the design challenges faced by MSV-based 3D-ICs floorplanning, our research will focus on following parts. Firstly, by modeling the thermal effect and physical architecture of 3D-ICs, the voltage assignment and its co-optimization with flooplanning algorithm will be proposed. Secondly, by exploring the deadspace management method during floorplaning, we develop the level shifter planning algorithm under both the timing and physical constraints. Thirdly, by power/ground (P/G) network modeling, a voltage drop driven power pad assignment and P/G TSV placement algorithm will be proposed. Finally, experimental verification platform is established to verify the validity of the proposed methods. The project will provide scientific guidance and technical support for 3D-ICs design, which has important theoretical value and application prospect.

英文关键词： Layout design;Design optimization;Optimization algorithm;EDA