包含多尺度结构的晶圆级透镜阵列设计和制造关键技术研究

项目名称： 包含多尺度结构的晶圆级透镜阵列设计和制造关键技术研究

项目编号： No.61505107

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 无线电电子学、电信技术

项目作者： 万新军

作者单位： 上海理工大学

项目金额： 20万元

中文摘要： 面向移动终端的光学相机模组生产已经发展为一个巨大产业。晶圆级封装光学相机因其生产高效和体积紧凑特点成为业界研究热点。核心元件8英寸晶圆级透镜阵列在制程中采用介质膜方式实现增透，受到晶圆变形和膜层破裂等问题严重影响。.针对此问题，提出一种包含多尺度结构的新型晶圆级透镜阵列器件，同时涵盖百纳米尺度抗反射纳米结构阵列，百微米尺度口径成像透镜和百毫米尺度晶圆基底。本项目围绕此器件的设计和制造关键技术展开研究；建立曲面基底上纳米结构阵列抗反射理论模型，优化纳米结构阵列的构型和几何特征参数设计；研究开发同时包含微透镜阵列和纳米结构阵列的8英寸晶圆级透镜阵列硬模具制造技术，重点解决曲面阵列上纳米结构阵列的制造技术难题；建立曲面基底上纳米压印复制技术的脱模受力模型，优化脱模工艺设计。本项目研究将为多尺度结构晶圆级透镜阵列的产业应用打下坚实基础，并为类似的微纳复合结构新型器件研究提供借鉴。

中文关键词： 微透镜阵列；晶圆光学；亚波长结构；抗反射效应

英文摘要： The production of camera modules for mobile terminals has grown into a massive industry. Wafer level packaging based camera module (WLC) production process has attracted wide industry interest due to its high production efficiency and compact size. The 8-inch wafer level lens array is the core component of the WLC process, however currently it is subject to warpage risk in the process of anti-reflection (AR) coating, and the dielectric AR coating itself suffers from risk of breaking when the wafer lens experiences high temperature. .The proposed project here aims to solve this problem by inventing a multi-scale functional structure based wafer level lens array, which encompasses hundreds nanometer level nano-structure array for anti-reflection effect, hundreds micrometer level micro-lens array for camera imaging and finally hundreds millimeter level wafer substrate for WLC process. The project centers around the key technologies in the design and manufacturing of the proposed novel component. An accurate model will be set up to simulate the anti-reflection effect of nano-structure array on curved lens profile, and to optimize the nano-structure configuration and geometrical parameters. The project will develop the process to manufacture the hard mold of the 8-inch wafer level lens array, which includes both micro lens array and nano-structure array. The key challenge is to manufacture nano-structure array on the curved surfaces of the whole wafer micro lens array. A new mold release model will be studied to simulate and optimize the nano-imprinting replication process on curved surfaces. The proposed project will lay a solid foundation for the industrial acceptation of the novel multi-scale functional structure based wafer level micro lens array, and offer instructive guidance to the research of similar novel components based on the micro/nano scale composite structure.

英文关键词： Micro-lens array;Wafer level optics;Sub-wavelength nano-structure array;Anti-reflection effect