In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms.
翻译:在这项工作中,我们提出了解决半导体包件基质设计过程中出现的路由问题的新信号路由方法。我们的工作使用包件基质层的地形变换,以简化路由问题,将其简化为在圆形上与非交叉直线段连接点的问题。我们称之为圆形框架的圆形是一个多边形图案,最初用于在地形学中研究两层结构的地形结构。我们通过实验显示,我们基于环形框架的新路由方法与某些基于网格的路由算法竞争。