As integrated circuit technologies are moving to smaller technology nodes, Electromigration (EM) has become one of the most challenging problems facing the EDA industry. While numerical approaches have been widely deployed since they can handle complicated interconnect structures, they tend to be much slower than analytical approaches. In this paper, we present a fast semi-analytical approach, based on the matrix exponential, for the solution of Korhonen's stress equation at discrete spatial points of interconnect trees, which enables the analytical calculation of EM stress at any time and point independently. The proposed approach is combined with the extended Krylov subspace method to accurately simulate large EM models and accelerate the calculation of the final solution. Experimental evaluation on OpenROAD benchmarks demonstrates that our method achieves 0.5% average relative error over the COMSOL industrial tool while being up to three orders of magnitude faster.
翻译:由于集成电路技术正在转向较小的技术节点,电流迁移(EM)已成为埃达工业面临的最具挑战性的问题之一,虽然数字方法由于能够处理复杂的互连结构而被广泛采用,但往往比分析方法要慢得多。在本文中,我们根据矩阵指数,提出了一个快速半分析方法,用于在互连树木的离散空间点解决科霍宁的压力方程式,这样就可以在任何时间和任何地点独立地分析计算EM应力。提议的方法与扩展的Krylov子空间方法相结合,以准确模拟大型的EM模型并加速最终解决方案的计算。 OpenROAD基准的实验评估表明,我们的方法比COMSOL工业工具平均差0.5 %, 同时速度要快到三个数量级。