The separation of the data capture and analysis in modern vision systems has led to a massive amount of data transfer between the end devices and cloud computers, resulting in long latency, slow response, and high power consumption. Efficient hardware architectures are under focused development to enable Artificial Intelligence (AI) at the resource-limited end sensing devices. One of the most promising solutions is to enable Processing-in-Pixel (PIP) scheme. However, the conventional schemes suffer from the low fill-factor issue. This paper proposes a PIP based CMOS sensor architecture, which allows convolution operation before the column readout circuit to significantly improve the image reading speed with much lower power consumption. The simulation results show that the proposed architecture could support the computing efficiency up to 11.65 TOPS/W at the 8-bit weight configuration, which is three times as high as the conventional schemes. The transistors required for each pixel are only 2.5T, significantly improving the fill-factor.
翻译:现代视觉系统中数据收集和分析的分离导致终端装置和云型计算机之间大量数据传输,导致长时间延迟、反应迟缓和高电耗。高效硬件结构正在重点开发中,以便在资源有限的终端遥感设备上进行人工智能(AI) 。最有希望的解决方案之一是能够实施Pixel(PIP)处理计划。然而,常规方案受到低填充因子问题的影响。本文建议建立一个基于PIP的 CMOS传感器结构,允许在柱体读出电路前进行回流操作,以大大降低电耗,大大提高图像读取速度。模拟结果表明,拟议的结构可以支持8位重配置的11.65 TOPS/W的计算效率,该配置的值是常规计划的三倍。每个像素所需的晶体管只有2.5T,显著改进了填充因因子。