The increasing popularity of ultra-wideband (UWB) technology for location-based services, such as access control and real-time indoor track&tracing, as well as UWB support in new consumer devices such as smartphones, has resulted in the availability of multiple new UWB radio chips. However, due to this increase in UWB device availability, the question of which (industry) standards and configuration factors impact UWB interoperability and compatibility becomes increasingly important. In this paper, the fundamentals of UWB compatibility are investigated by first giving an overview of different UWB radio chips on the market. After that, an overview of UWB standards and organizations is given. Next, this overview is used to discuss the focus of these different standards and to identify the differences between them. We describe compatibility issues and associated interoperability aspects related to physical (PHY), medium-access-control (MAC) and upper layers. For the PHY layer, compatibility is possible for all UWB radio chips if the correct settings are configured. For the MAC layer, the implementation of the multiple access scheme as well as the localization technique is mostly proprietary. For the device discovery, several standards are currently being drafted. Finally, future challenges related to UWB interoperability are discussed.
翻译:超广域(UWB)技术对基于地点的服务越来越受欢迎,例如入口控制和实时室内跟踪等超广域(UWB)技术,以及世行对智能手机等新消费装置的支持,使得世行的无线电芯片能够提供多种新的UWB无线电芯片,然而,由于世行装置的可用性增加,哪些(工业)标准和配置因素对世行的互操作性和兼容性产生影响的问题变得越来越重要。在本文件中,世行兼容性的基本内容首先通过概述世行市场上不同的无线电芯片来调查。随后,对世行的标准和组织作了概述。接着,本概览被用来讨论这些不同标准的重点和差异。我们描述了兼容性问题以及与物理(PHY)、中接入控制(MAC)和上层相关的互操作性问题。对于PHY层,如果设置了正确的环境,世行所有无线电芯片的兼容性是可能的。对于市行管层而言,多种接入计划的实施以及本地化技术基本上是专有的。关于设备发现问题,目前正在起草一些标准。