With high device integration density and evolving sophisticated device structures in semiconductor chips, detecting defects becomes elusive and complex. Conventionally, machine learning (ML)-guided failure analysis is performed with offline batch mode training. However, the occurrence of new types of failures or changes in the data distribution demands retraining the model. During the manufacturing process, detecting defects in a single-pass online fashion is more challenging and favoured. This paper focuses on novel quantile online learning for semiconductor failure analysis. The proposed method is applied to semiconductor device-level defects: FinFET bridge defect, GAA-FET bridge defect, GAA-FET dislocation defect, and a public database: SECOM. From the obtained results, we observed that the proposed method is able to perform better than the existing methods. Our proposed method achieved an overall accuracy of 86.66% and compared with the second-best existing method it improves 15.50% on the GAA-FET dislocation defect dataset.
翻译:在半导体芯片中,由于装置集成密度高和尖端装置结构不断演变,检测缺陷变得难以捉摸和复杂。 通常,机器学习(ML)引导故障分析是通过离线分批培训进行的。然而,如果发生新型故障或数据分配变化,则需要重新对模型进行再培训。在制造过程中,以单程在线方式检测缺陷更具挑战性和倾向性。本文侧重于半导体故障分析方面新型的微量在线学习。拟议方法适用于半导体装置级缺陷:FinFET桥缺陷、GAA-FET桥缺陷、GAA-FET脱轨缺陷以及公共数据库:SECOM。我们从所获得的结果中发现,拟议方法能够比现有方法更好。我们提出的方法总精度达到86.66%,与现有第二最佳方法相比,在GA-FET脱轨缺陷数据集上提高了15.50%。</s>