Ni-W-P/Cu双镀层无铅焊点界面微结构及其剪切失效行为

项目名称： Ni-W-P/Cu双镀层无铅焊点界面微结构及其剪切失效行为

项目编号： No.51465039

项目类型： 地区科学基金项目

立项/批准年度： 2015

项目学科： 机械、仪表工业

项目作者： 胡小武

作者单位： 南昌大学

项目金额： 48万元

中文摘要： 镀Ni-P层无铅焊点界面出现的脆性富P层、界面化合物剥落及镀层被破坏等问题严重制约了其作为阻挡层作用的发挥和应用。因此，为了解决这一系列问题，本项目提出采用化学镀Ni-W-P/电镀Cu双镀层技术制备高可靠性Sn58Bi无铅互连焊点，围绕焊点界面微结构及其剪切失效行为的基础科学问题展开研究。探究焊点界面反应、微观结构、结合机理、金属间化合物（IMC）生长动力学及抑制IMC剥落机理；从界面分形理论新视角，重点研究双镀层焊点IMC/焊料界面的分形特征，建立焊点不规则界面分形特征与焊接工艺或时效参数的关系；测试Ni-W-P单、双镀层焊点的剪切强度并进行对比分析，明晰双镀层焊点的强化效果；进一步探讨双镀层焊点界面剪切变形机制、裂纹扩展和断裂机理；定量描述双镀层焊点剪切强度及其失效行为与界面IMC尺度、形态和分形特征之间的关系。项目有助于高可靠性互连焊点的设计与制造，具有较大的科学意义和应用价值。

中文关键词： 无铅焊料；焊接接头；界面反应；金属间化合物；力学性能

英文摘要： The emergences of brittle P-rich layer, spalling of intermetallic compound and breakdown of plating at the interface of electroless Ni-P plating lead-free solder joint seriously restrict its application as a diffusion barrier. Therefore, in order to solve the series of issues, a new technology is proposed to produce Sn58Bi lead-free solder interconnect with high reliability by adopting a bi-layer of electroless Ni-W-P/electroplating Cu. The project mainly focus on the fundament of scientific issues about interfacial microstructure and shear failure behavior of solder joint. The interfacial reaction, microstructure, bonding mechanism, growth kinetics of intermetallic compound and the mechanism of suppressing IMC to spall will be researched. From the perspective of interfacial fractal, the characterization in fractal of IMC/solder in bi-layer plating solder joint will be primarily investigated, and the relationships between irregular interfacial characterization of fractal and the parameters of soldering process or aging treatment will be set up. The shear strengths of single Ni-W-P plating and bi-layer plating solder joints will be tested, and a comparative analysis will be conducted between their results. Subsequently, the strengthen effect of the bi-layer plating will be clarified. Furthermore, the mechanism of interfacial shear deformation, crack propagation and fracture mechanism of the solder joint will be studied. Eventually, the relationships between the shear strength and the scale, morphology and fractal of interfacial IMC in bi-layer plating solder joint. The study results will contribute to the design and manufacture of solder interconnets with high reliability. It is of scientific significance and application value.

英文关键词： lead-free solder;solder joint;interfacial reaction;intermetallic compound;mechanical property