基于动态纳米压痕技术的低银无铅结构焊点的力学行为研究

项目名称： 基于动态纳米压痕技术的低银无铅结构焊点的力学行为研究

项目编号： No.11502065

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 数理科学和化学

项目作者： 牛晓燕

作者单位： 河北大学

项目金额： 16万元

中文摘要： 在振动、跌落/冲击等载荷条件下，应变率和温度效应对材料力学性能具有重要影响。由于传统测试手段的局限性，本项目拟在现有的Hopkinson压杆技术的基础上，结合纳米压痕测试原理，制作动态纳米压痕实验系统，以高密度、高集成度封装的微米低银无铅结构焊点（包括Cu焊盘、低银焊料Sn0.3Ag0.7Cu以及金属间化合物IMC层）为研究对象，获得其基础动态力学性能参数。进而采用基于有限元的数值模拟手段来模拟动态荷载下低银无铅结构焊点的力学行为，阐明其微观演化机制。通过建立和完善微封装结构跌落/冲击下的动态响应模型，为微尺寸低银无铅结构焊点的可靠性提供评估手段。本项目的研究结果，将为微米量级材料动态力学性能的测试和分析提供实验和理论依据，为低银无铅结构焊点在航空航天、动车组、汽车等电子产品抗跌落冲击方面提供技术支持。

中文关键词： 动态压痕实验；低银结构焊点；跌落/冲击；应变率效应；温度效应

英文摘要： Under the condition of vibration, drop and impact, the strain rate and temperature have an important effect on the mechanical properties of materials. Due to the limitations of traditional testing methods, this project aims to establish a dynamic indentation-based experiment testing method by use of the existing Hopkinson pressure bar apparatus and the test principle of nanoindentation, and derive the material parameters of dynamical properties of micron-sized low-silver lead-free structure joint (including Cu bonding pad, low-silver solder Sn0.3Ag0.7Cu and intermetallic compounds (IMC)) with high density and high integration in package. Then, the finite element method-based numerical approach will be presented to simulate the mechanical behaviors of the low-silver lead-free solder joint subjected to dynamical loads, and illustrate the micromechanical evolution mechanism. The developed mechanical model of dynamical response of micro-packaging structure under drop/impact loads, is expected to provide a possible evaluation approach to the reliability of the micron-sized low-silver lead-free solder joint under drop and impact loads. The investigated results of this project will provide the experimental and theoretical foundation for the testing and analysis of dynamic mechanical properties of micro-sized materials. Also, they will provide a technical support for the resistance of drop and impact of low-silver lead-free structure joint in electronics widely applied in aerospace, Electric Multiple Unit and auto industry.

英文关键词： dynamic indentation experiment;Low-silver lead-free structure joints;drop/impact;strain rate effect;temperature effect