基于TSV的三维集成关键技术研究

项目名称： 基于TSV的三维集成关键技术研究

项目编号： No.61334003

项目类型： 重点项目

立项/批准年度： 2014

项目学科： 无线电电子学、电信技术

项目作者： 杨银堂

作者单位： 西安电子科技大学

项目金额： 260万元

中文摘要： 面向超高密度存储器应用，重点研究基于多种材料TSV的三维集成电路TSV建模及信号完整性、互连功耗优化、热管理和热分布等方面的系列科学问题，并探索基于TSV的三维光电集成等前沿科学问题，在基于TSV的三维集成电路设计方法学、信号完整性、热管理、光电混合集成、新型三维存储器等形成创新性的突破。本项目将建立多种材料TSV的电磁模型，研究宽工作频率的TSV互连信号完整性，研究三维存储器的耦合和动态耦合技术、优化通孔分布和引脚阵列分布。研究建立TSV三维集成电路的热解析模型，获得TSV分布对互连线温度影响的数值解析模型，实现三维集成电路热的热通孔最优化分配技术。掌握TSV成本、散热路径效能、空白区分布、3D全局互连线特性等三维集成电路优化设计方法学，在三维集成电路划分、热优化、全局互连线优化等方面形成自主关键技术。探索研究光TSV结构和大容量、低损耗的光路由器结构，验证新型超高密度三维存储器。

中文关键词： 硅通孔;三维集成电路;;;

英文摘要： For ultra-high density memory applications, the project focusing on research based on a variety of materials TSV modeling and signal integrity, interconnect power consumption optimization, thermal management and thermal distribution of a series of scientific questions for three-dimensional integrated circuits, and to explore the TSV-based of 3D optoelectronic integrated and other cutting-edge scientific issues, learn TSV-based three-dimensional integrated circuit design, signal integrity, thermal management, and opto-electronic hybrid integration, the new three-dimensional memory, such as the formation of innovative breakthroughs. The project will build on a variety of materials TSV electromagnetic model to study a wide operating frequency TSV interconnect signal integrity, and to study the three-dimensional memory coupling and dynamic coupling technology, optimize the distribution of through-hole and pin array distribution. The thermal TSV most established TSV the thermal analytic model of the three-dimensional integrated circuits, TSV distribution model of the numerical analysis of the impact of interconnect temperature and three-dimensional integrated circuit thermal optimization allocation techniques. The master the TSV cost of, performance thermal path, blank distribution optimization design methodology the 3D global interconnect line characteristics, such as three-dimensional integrated circuits, divided in three-dimensional integrated circuits, thermal optimization, global interconnect optimization has formed own key technologies. Exploration and study light the TSV structure and large capacity, low-loss optical router structure, to verify that the new ultra-high-density three-dimensional memory.

英文关键词： TSV;3D-ICs