复杂条件下微波多层电路互连过孔结构最优设计及测试研究

项目名称： 复杂条件下微波多层电路互连过孔结构最优设计及测试研究

项目编号： No.61201006

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 电子学与信息系统

项目作者： 田雨

作者单位： 电子科技大学

项目金额： 25万元

中文摘要： 由于电路和器件持续集成化和小型化的发展趋势，导致在不同领域多层电路层间互连过孔结构的应用越来越广泛，但同时互连过孔结构所引入的非理想特性也成为制约电路性能提高的重要瓶颈。因此针对过孔结构的等效电路建模、最优设计方法和测试方法是近年来研究的难点和热点。本研究将复杂条件下微波多层电路层间互连过孔结构作为研究对象，提出使用混合分析方法对不同边界条件、不同物理结构参数、不同应用规模的互连过孔结构电磁特性进行研究，分析其影响规律并建立层间互连过孔结构的完整等效电路模型，在此基础上提出过孔的阻抗控制和补偿方法，探索过孔结构的最优设计途径。同时项目将进行过孔结构的测试和去嵌入方法研究并予以实施，最终通过仿真验证和测试验证相结合的手段对最优设计方法进行分析和评价。研究成果将为目前互连过孔结构在电路尤其是微波多层电路和高速数字电路中的最优设计和最佳应用提供新的方法和思路。

中文关键词： 电路建模；等效电路；模型；仿真；过孔

英文摘要： Interconnected vias are more and more widely used in different applications with the growing trend of the integration and miniaturization for circuits and components. However, the introduction of non-ideal characteristics from vias has been the important bottleneck which restricts the performance of circuits. The equivalent circuit modeling ,the optimal design and the test research had become one of the major and difficult problems in relevant fields during the recent years. In our project, vias including the complex conditions in microwave multilayer circuits will be regarded as the research object, and the electromagnetic characteristics of vias will be researched by the proposed hybrid method with different conditions,different parameters of physical structures and different dimensions.Furthermore the law of the impact will be analyzed and the complete equivalent circuit model will be established. Moreover, the method of the impedance control and compensation will be proposed and the optimal design method will be explored for vias. In the meantime the test and de-embedding method will also be researched for analysis and evaluation of the optimal design method with the combination of simulation. The research results will provide some novel methods and ideas for the optimal design method about vias in circuits

英文关键词： circuit modeling；equivalent circuit；model；simulation；via