微纳米尺度无铅焊点及金属聚合物层间破坏机理研究

项目名称： 微纳米尺度无铅焊点及金属聚合物层间破坏机理研究

项目编号： No.51301136

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 一般工业技术

项目作者： 姚尧

作者单位： 西北工业大学

项目金额： 25万元

中文摘要： 随着电子设备向小型化及高性能化发展，微电子封装结构中高密集度焊点在不同工作条件下的破坏机理与损伤检测是目前国内需求迫切、应用前景广阔的研究方向。传统研究主要针对由于芯片和基板元器件与印制电路板材料热膨胀系数的差异在焊点内产生热应力造成焊点的疲劳、蠕变损伤。近年来，由于无铅钎料的广泛采用以及新型电子设备中的焊点尺寸缩小至微纳米尺度，金属聚合物对焊点工作性能和寿命也带来越来越大的影响，并引起了以焊球/金属聚合物层间准脆性破坏为代表的新的焊点破坏模式。本项目将通过试验、结合理论分析和数值仿真研究无铅焊点在不同温度和电流强度下的材料特性以及试件在热-电-力复合载荷作用下的破坏机理。重点研究疲劳热应力、焦耳热以及电流密集效应等因素引起焊球/金属聚合物层间破坏对焊点性能的影响，从而了解微尺度无铅焊点在不同工作条件下的电热力学性能、损伤及破坏机理及其对微电子封装连接结构工作性能的影响。

中文关键词： 微焊点；封装结构；失效机理；金属间聚合物；多场耦合

英文摘要： With continuing reduction in size and the transition to high performance electronic devices, microelectronic packaging has much denser solder joints and higher working current density. Solder joint integrity is recognized as a key issue in the reliability of flip chip and ball grid arrays in integrated circuit packages. Significant reductions in the solder-joint interconnect size results in both the increased volume fraction of brittle intermetallics in the joint and joule heating due to high current density. Previously, the prevalent failure mode in a solder joint was the ductile thermo-mechanical fracture of solder material due to repeated thermal cycling. Most of the traditional researches focus on the fatigue and creep damage of solder joints due to thermal stress which caused by the mismatch in thermal expansion coefficient between silicon die, substrate components and printed circuit board. With the widely application of lead-free solders and the size of solder joints reducing to micro-nano scale in the latest electronic devices, the effect of intermetallic compound (IMC) to the lifetime and performance of solder joints has increased sharply. Leading to a new joints failure mode represented by the layer quasi-brittle failure in solder bulk/IMC. This project combines experiments, theoretical analysis and

英文关键词： Micro-solder；electronic packaging；failure mechanism；intermetallic；multi-field coupling