新型多功能微/纳米胶囊的合成及其高性能热固性树脂结构与性能研究

项目名称： 新型多功能微/纳米胶囊的合成及其高性能热固性树脂结构与性能研究

项目编号： No.51273135

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 一般工业技术

项目作者： 袁莉

作者单位： 苏州大学

项目金额： 80万元

中文摘要： 针对目前微/纳米胶囊(M/NCs)在发展自修复高性能热固性树脂基复合材料存在耐热性差与高性能热固性树脂在发展高科技高频技术领域产品中存在固化温度高、热膨胀系数(CTE)高及介电性能偏高等问题，基于M/NCs在树脂基复合材料应用潜力，提出以负载催化剂、导热及中空粒子的具有孔隙结构囊壁的含修复剂的耐热性优异的多功能M/NCs解决上述问题的新思路。项目以典型高性能热固性双马来酰亚胺(BMI)树脂为研究对象。研究内容主要包括：多功能M/NCs设计与合成；M/NCs结构表征与性能测试；囊芯修复剂与其催化剂作用原理；M/NCs对BMI结构与性能影响规律；材料实现自修复条件及自修复效率等。通过研究，获得多功能M/NCs，阐明M/NCs结构与性能-BMI树脂结构与性能关系，最终实现BMI树脂的自修复、低温固化、低CTE、低介电性能的有机统一，建立制备高科技高频领域产品用的高性树脂体系新理论模型与技术框架。

中文关键词： 微/纳米胶囊；高性能热固性树脂；自修复；低温固化；低介电性能

英文摘要： Considering the fact that the current M/NCs cannot be used for developing self-healing high performance thermosetting resin composites owing to their low thermal stability, and the high performance thermosetting resin for developing high-tech and high frequency products have the main disadvantages such as high curing temperature, high coefficient of thermal expansion(CTE) and somewhat higher dielectric property, a new idea of using very thermally stable mutifunctional micro/nano capsules(M/NCs) containing healing agent and having multi-pore wall shell loaded with catalysty, thermally conductive and hollow particles to solve the above meantioned problems will be put forward based on the mutifunctional applications of M/NCs in resin matirx. In this project, the typical high performance thermosetting bismaleimide(BMI) resins will be selected as the investigated resins. The main research contents will include the design and synthesis of multifunctional M/NCs, the structure characterization and property testing of M/NCs, the mechanism of action between the healing agent core materials and their catalysts, the effects of M/NCs on the structure and property of BMI resins, the favorable conditions for self-healing and the self-healing efficiency, etc. Based on that, the multifunctional M/NCs will be obtained, the relati

英文关键词： Micro/nano capsules；high performance thermosetting resin；self-healing；low temperature curing；low dielectric property