一种用于电子封装结构热力学分析的有限元-虚拟元耦合方法 (A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures)

This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging.

翻译：本研究提出了一种用于电子封装结构热力学分析的有限元与虚拟元（FE-VE）耦合方法。该方法对计算域进行策略性分区，对规则几何形状采用有限元法（FEM）以最大化计算效率，对复杂形状采用虚拟元法（VEM）以增强几何灵活性。通过重合节点对应关系保持界面相容性，确保跨域边界解的连续性，同时降低网格划分复杂性和计算开销。通过电子封装应用进行的验证表明，该方法与参考解具有合理的一致性，并且在不同的网格密度下表现出可接受的收敛特性。该方法能有效捕捉多材料系统中的热分布和应力集中，为涉及复杂几何形状的电子封装分析建立了一个实用的计算框架。源代码可在 https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging 获取。