高导热石墨膜制备及导热机理研究

项目名称： 高导热石墨膜制备及导热机理研究

项目编号： No.U1537106

项目类型： 联合基金项目

立项/批准年度： 2016

项目学科： 一般工业技术

项目作者： 赵松

作者单位： 中国航天科技集团公司第四研究院

项目金额： 55万元

中文摘要： 本项目基于电子工业对高效散热材料的需求，设计开发聚酰亚胺基（PI）导热石墨膜和石墨烯两种厚度分别在微米、纳米尺度的高导热石墨膜。利用PI薄膜作为前驱体，通过炭化-石墨化工艺，制备PI基高导热石墨膜，并以此为原料，使用机械剥离手段制备石墨烯材料。如何通过高导热石墨膜的制备研究明晰高导热石墨膜的导热机理，是项目需要解决的关键问题。借助微观结构设计与调控，通过试验与理论结合的方法重点研究材料制备过程中的结构转变规律；通过结构表征和性能测试，建立材料的热学性能与原材料组分结构及制备工艺参数的关联性。项目在制备工艺、结构设计与控制、热学性能表征等方面的研究具有创新性。通过研究，获得PI基高导热石墨膜及衍生石墨烯的优化制备工艺，揭示材料的制备工艺、微观结构与其热学性能的关系规律，阐明微纳米厚度尺度高导热石墨膜的导热机理，实现高导热石墨膜的制备及综合性能优化。

中文关键词： 石墨；石墨化；柔性石墨；热处理；导热

英文摘要： In order to fulfill the requirement of heat dissipation material with high efficiency for electronic industry, two kind of graphite films with high thermal conductivity, polyimide (PI)-derived graphite and graphene, are designed and developed. PI-derived graphite film is fabricated using PI film precursor and treated by carbonization and graphitization process. Graphene is obtained by mechanical exfoliation process using PI-derived graphite film as raw material. The key scientific issues of this project are the fabrication of material、characterization of micro-structure、 evaluation of thermal performance and establishment of the thermal conduction mechanism model. Based on the design and control of micro-structure, the law of micro-structure transformation during fabrication is studied. The relationship between process, micro-structure and thermal properties is established. The innovation of this project included designing and preparing the materials, controlling the micro-structure. As results, optimizing preparation processes for the graphite films, including PI-derived graphite film and graphene, are obtained. Especially, the relationships with the preparation process, the micro-structure and the thermal properties of the materials are established. The thermal conduction mechanism of graphite films with micro/nano-scale is explained. Finally, the graphite films with optimize thermal properties are developed.

英文关键词： graphite;graphitization;flexible graphite;heat treatment;thermal conductivity