项目名称: 用于光照上网技术的CMOS全集成可见光通信发射端系统芯片的研究与设计
项目编号: No.61504114
项目类型: 青年科学基金项目
立项/批准年度: 2016
项目学科: 无线电电子学、电信技术
项目作者: 吴亮
作者单位: 香港城市大学深圳研究院
项目金额: 21万元
中文摘要: 国家的节能环保和可持续发展战略极大地推动了发光二极管(LED)照明技术的发展和应用,同时为基于LED的光照上网技术(Light Fidelity, Li-Fi)的应用提供了有力的硬件支撑。与已经广泛使用的无线上网技术如Wi-Fi相比, Li-Fi具有频谱宽、无辐射、稳定性高和保密性好等优点,潜力巨大,前景广阔。现在Li-Fi发射端通常采用分立器件实现,能量效率低、成本高,不能集成于移动电子设备中。本课题在国内外首次提出全集成的可见光发射端系统芯片的研究与设计,目标是在超过2米的距离上获得5Mb/s 的可见光通信数据率,为Li-Fi技术的进一步发展与应用奠定硬件基础。项目将从以下几方面开展研究:1)在系统层面上解决数字调制和LED驱动的接口问题;2)数字基带根据不同信道条件采用最优的编码和调制方案;3)解决LED驱动存在的速率和效率问题,最后实现一个CMOS全集成的Li-Fi发射端系统芯片。
中文关键词: 混合信号集成电路;可见光通信;电源转换器;系统芯片;光照上网技术
英文摘要: National energy conservation, environmental protection and sustainable development strategies have greatly motivated the development of light-emitting diode (LED) technologies for lighting. The ubiquitous deployment of LED lights provides an opportunity for innovative optical applications, i.e. light-fidelity (Li-Fi), other than just simple for lighting. Thanks to the advantages including much wider spectrum, no RF radiation, high stability and high security compared with conventional wireless like Wi-Fi, Li-Fi is being regarded as one of the most promising technologies for the next-generation wireless communications. However, existing Li-Fi transmitters are constructed with discrete components, leading to low energy efficiency, high cost and not being able to integrate with mobile electronics. The objective of this project is to design and implement the first fully integrated Li-Fi transmitter system-on-a-chip (SoC) with 5Mb/s visible light communication data rate over 2 meters. It would certainly help the further development and application of Li-Fi based on LEDs. The research work includes: 1) addressing the interface between the digital modulation and the LED driver, 2) optimizing the coding and modulation schemes according to the channel conditions; 3) enhancing both the switching frequency and the power efficiency of the LED driver, and finally demonstrating a fully integrated Li-Fi transmitter in CMOS technology.
英文关键词: Mixed-Signal Integrated Circuits;Visible Light Communication;Power Converter;System-on-a-Chip;Li-Fi Technology