项目名称: 数字密集型超高速毫米波通信集成电路关键技术研究
项目编号: No.61774093
项目类型: 面上项目
立项/批准年度: 2018
项目学科: 无线电电子学、电信技术
项目作者: 池保勇
作者单位: 清华大学
项目金额: 16万元
中文摘要: 毫米波频谱资源丰富,被认为是5G通信中提供超高数据率的有效技术方案。但传统方法实现的毫米波通信芯片面积大并不随工艺换代而缩小,使得芯片成本随工艺升级而直线上升;同时其性能对工艺变化和封装效应敏感,造成产品成品率低。有限的链路带宽也限制了毫米波通信芯片支持的数据率。本项目围绕数字密集型超高速毫米波通信集成电路关键技术展开如下方面的研究:研究数字密集型超高速毫米波通信系统芯片的系统架构;研究超高速毫米波通信电路的数字化技术及电路实现技术,对难以数字化的关键毫米波电路模块,采用数字辅助自校准技术改善其性能;研究毫米波通信电路扩展链路带宽的有效方法。本项目拟通过引入数字密集型设计技术和链路带宽扩展技术,致力于解决超高速毫米波通信系统芯片设计中面临的核心问题,为我国5G方案的研发奠定良好的硬件基础。
中文关键词: 毫米波集成电路;射频集成电路;集成电路设计;无线收发机;CMOS
英文摘要: Mm-wave could provide enough bandwidth to support high data rate communication and would be used in the future fifth-generation (5G) mobile communication. But mm-wave communication chips designed with the conventional design methodology consume large chip area and do not scale down with technology development, which results in much higher cost in the more advanced technology. Their performance is also sensitive to the process variation and package parasitics, leading to low product yield. Furthermore, limited link bandwidth limits the data rate of mm-wave communication chips. The project would research on key techniques of digital-intensive high data-rate mm-wave communication integrated circuits, including: (1) System architecture of digital-intensive high data-rate mm-wave communication chip; (2) Digitalization technique as well as implementation of high data-rate mm-wave communication circuits. Digital-assisted self-healing is used to improve the performance if it is difficult to digitalize some key mm-wave circuit blocks; (3) Effective design methodology to expand the link bandwidth and improve the data-rate. The project aims to solve the crucial challenges in the development of high data-rate mm-wave communication chips by introducing digital-intensive design technique and link bandwidth expansion technique, and would make a solid hardware foundation for future 5G system development.
英文关键词: Mm-Wave Integrated Circuits;RF Integrated Circuits;Integrated Circuit Design;Wireless Transceiver;CMOS