高压大电流IGBT模块内部多物理场分析与拓扑优化研究

项目名称： 高压大电流IGBT模块内部多物理场分析与拓扑优化研究

项目编号： No.51477048

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 电工技术

项目作者： 赵志斌

作者单位： 华北电力大学

项目金额： 90万元

中文摘要： 高压大电流IGBT模块内部拓扑的优化设计对高效散热、减小寄生参数、提高功率密度、设计适应瞬时高压或大电流等特殊应用的专用IGBT模块具有重要意义。本项目针对高压大电流IGBT模块内部封装材料选择和拓扑优化问题，借助于测量和试验手段，以考虑温度影响的IGBT晶片和FRD晶片动静态模型为基础，依托考虑杂散参数的电路建模与电、磁、热多物理场分析方法，建立IGBT模块内部电压、电流和温度场的耦合模型，并研究不同材料特性参数和拓扑结构对器件内部电压、电流均衡和散热效率的影响规律，结合封装材料特性与几何布置等的灵敏度分析，提出实现均压、均流和高效散热且具有应用针对性的IGBT模块内封装材料选择与拓扑结构设计方案。以期为IGBT模块内部的结构优化设计提供理论支撑和技术指导。

中文关键词： 电磁场数值计算；优化设计；IGBT模块；多物理场；温度场

英文摘要： The optimization of IGBT module internal topology make special significance to enhancing the efficiency of heat dissipation, reducing the parasitic parameters, increasing power density, designing special IGBT module to meet the transient high voltage or high current applications. Aiming at the internal packaging material's selection and topology optimization's problems of the high voltage high current IGBT module, the project will present is to give a scheme of the selection of IGBT internal package material and the design of IGBT internal topology to realize equalization voltage, equalization current, high efficiency heat dissipation and special applications, by measuring and testing instruments, based on static and dynamic model of the IGBT chip and FRD chip, which affected by temperature, relied on the circuit model of considering circuit stray parameters and the multi-physics analysis methods of electric, magnetic, thermal, established an internal IGBT coupling module of voltage, current and temperature field, researched the parameters of different material properties and the influence of topology of the device to internal voltage, current, and thermal dissipation efficiency , and combined with the sensitivity analysis of the package material properties and geometric layout. In order to provide theoretical support and technical guidance for the IGBT module's internal structure optimization design.

英文关键词： Numerical Analysis of Electromagnetic field;optimization design;IGBT module;multi-physics field;thermal field