The growing availability of the data collected from smart manufacturing is changing the paradigms of production monitoring and control. The increasing complexity and content of the wafer manufacturing process in addition to the time-varying unexpected disturbances and uncertainties, make it infeasible to do the control process with model-based approaches. As a result, data-driven soft-sensing modeling has become more prevalent in wafer process diagnostics. Recently, deep learning has been utilized in soft sensing system with promising performance on highly nonlinear and dynamic time-series data. Despite its successes in soft-sensing systems, however, the underlying logic of the deep learning framework is hard to understand. In this paper, we propose a deep learning-based model for defective wafer detection using a highly imbalanced dataset. To understand how the proposed model works, the deep visualization approach is applied. Additionally, the model is then fine-tuned guided by the deep visualization. Extensive experiments are performed to validate the effectiveness of the proposed system. The results provide an interpretation of how the model works and an instructive fine-tuning method based on the interpretation.
翻译:从智能制造中收集的数据越来越容易获得,这正在改变生产监测和控制模式。除了时间变化不定的意外扰动和不确定因素外,裂谷制造过程日益复杂和内容日益丰富,使得用基于模型的方法进行控制进程变得不可行。结果,数据驱动的软遥感模型在长毛过程的诊断中变得更加普遍。最近,在软感测系统中利用了深层次的学习,在高度非线性和动态的时间序列数据上取得了有希望的性能。尽管在软感系统方面取得了成功,但深层次学习框架的基本逻辑却难以理解。在本文件中,我们提出了一个利用高度不平衡的数据集进行有缺陷的瓦费尔探测的深层次学习模型。为了了解拟议的模型如何运作,采用深度直观化方法。此外,模型随后在深度直观化指导下进行了精细的调整。进行了广泛的实验,以验证所拟议的系统的有效性。结果解释了模型是如何运作的,并提供了基于解释的有指导性的微调方法。