自修复型导电胶的制备和自修复效率表征研究

项目名称： 自修复型导电胶的制备和自修复效率表征研究

项目编号： No.51303016

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 一般工业技术

项目作者： 陶宇

作者单位： 常州大学

项目金额： 25万元

中文摘要： 导电胶已经作为Sn-Pb焊料的替代品在微电子封装行业沿用多年。目前电导率偏低以及可靠性差成为制约导电胶的重要因素。本项目研究从目前导电胶中存在的主要问题出发，一方面通过采用自制的一维银纳米线作为导电胶的导电填料，发挥一维纳米线的纤维状结构优势，使得填料在树脂基体中更容易形成导电网络来提高导电胶的电导率。另一方面采用乳液聚合法制备了壳为聚苯乙烯，核为分散有银纳米棒的聚硫醇与二甲基苯胺（DMBA）的混合物的核壳结构纳米粒子，利用这些纳米核壳结构粒子在外界作用力下，自动破裂，聚硫醇与DMBA的混合物与胶体中过量的环氧基团快速反应，自动快速修复受外力破坏产生的胶体微裂纹来提高导电胶的可靠性。通过系统研究自修复型导电胶的自修复体系对导电胶的电学及力学修复效率，修复机理以及修复过程动力学，用以指导自修复型导电胶的制备及产业化，同时为其他自修复复合材料的制备及应用提供可靠的理论依据。

中文关键词： 自修复；导电胶；微胶囊；失效；

英文摘要： Conductive adhesives have been widely used as a replacement for Sn-Pb solder in electrics packaging industries for many years. However, low conductivity and poor reliability have become the most important factors to restrict the development of conductive adhesives. In this project, we will try to solve these two shortages existed in actual applications by using a special method. On the one hand, one-dimensional silver nanowires are used as conductive filler in conductive adhesives which were prepared by redox method. The special fiber morphology will make these fillers more easy to contact each other to form a conductive network in resin,it will clearly improve the conductivity of the adhesive. On the other hand,microsized Polystyrene(PS)-Ag nanowires/Dimethylbenzylamine(DMBA)/Polythiol core-shell capsules were prepared by an emulsion polymerization method. A novel kind of self-healing conductive adhesive was developed by using these microcapsules as healing agents. When microcracks produced by outside force reached to these healing agents, the shell layer would be destroyed automatically and the healing agents in the core would release and react with access epoxy groups in resin substrates immediately, a new network would be formed again in bulk conductive adhesive, which has a healing effect for mechanical str

英文关键词： Self-healing；Electrical conductive adhesive；Micro-encapsulate；Failure；