柔性基板精细导电线路的加成法制备及可靠性研究

项目名称： 柔性基板精细导电线路的加成法制备及可靠性研究

项目编号： No.61471106

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 冯哲圣

作者单位： 电子科技大学

项目金额： 83万元

中文摘要： 项目针对目前COF柔性封装基板精细线路减成法制备中的技术瓶颈问题，提出了一种基于喷墨印刷的加成法制备技术：将溶液型油墨喷墨印刷在柔性基上形成具有催化活性的线路图形，再经受限控制催化沉积获得铜导电功能层。项目将瞄准油墨易喷印、无高温过程的应用需求，研究油墨的流体动力学特性、墨滴射流动力学、柔性基表面金属低温催化沉积的生长控制方法，优化柔性基上精细线路的电学性能；瞄准高精度的应用需求，研究墨滴特性与喷射状态控制技术、高精度数字图形转移技术、墨滴/基板界面行为、金属催化沉积动力学和受限控制催化机理，实现柔性基导电线路加成法高精度制备；瞄准可靠性的应用需求，建立精细线路在柔性变形下的力学模型并研究其失效机理、探讨导电膜层与基板的结合力提升手段、铜层特征尺寸与其电学及力学性能的关系，获得高可靠性导电线路制备技术。项目研究将为我国柔性电子产业的发展及相关科学问题的创新奠定理论和实验基础。

中文关键词： 柔性基；精细导电线路；加成法；喷墨印刷；可靠性

英文摘要： To solve the technical problems of the subtractive preparation method of fine lines used on the COF flexible packaging substrate, we proposed an additive preparation process based on ink-jet printing in this project. Solution-based ink is ink-jet printed on flexible substrates and patterns with catalytic activity will be obtained. The copper conductive layer will be obtained after limited and controlled catalytic deposition. Aiming at the application requirement of easy-to-print ink, high-temperature-free process, we will study the fluid dynamics of the ink, the jet and efflux dynamics of the ink droplets, and the low-temperature deposition controlling method of metal wires on the surface of flexible substrates, and optimize the electrical properties of fine conductive lines on flexible substrates; Aiming at the application requirement of high precision, we will study the droplet characteristics and its ejection state controlling technology, high-precision digital graphics transfer technology, the droplet-substrate interface behavior, and catalytic growth dynamics and controlled catalytic mechanism of metals to achieve flexible conductive circuits with high precision additive method; Aiming at the application requirement of reliability, the mechanical model of fine lines under flexible deformation is set up to study the failure mechanism and discuss the binding force enhancing method between conductive films and substrates. The relationship between copper layer feature size and its electrical and mechanical performances are also discussed to obtain highly reliable conductive line preparation technology. The research project will lay theoretical and experimental foundation for the development of flexible electronics industry and innovation of related scientific issues.

英文关键词： flexible substrates;fine conductive lines;additive process;ink-jet printing;reliability