基于三维SoP的高性能微处理器片上互连和存储研究

项目名称： 基于三维SoP的高性能微处理器片上互连和存储研究

项目编号： No.61272139

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 自动化技术、计算机技术

项目作者： 窦强

作者单位： 中国人民解放军国防科学技术大学

项目金额： 71万元

中文摘要： 高性能微处理器技术是国家安全和国防安全的重要基础技术。本项目针对未来10-15年高性能微处理器的下一代主流体系结构开展研究，研究基于SoP的高性能微处理器的片上三维光互连体系结构、基于网络演算的三维互连结构性能分析与优化和三维片上存储划分机制等。要解决的关键科学问题是高性能微处理器互连结构中功耗、带宽、延迟、面积、可靠性等综合性能的影响因子调整方法问题、基于网络演算的三维片上网络多个业务流竞争网络资源的复杂冲突建模问题和用户程序的访存行为模式的感知机制三个问题。项目的特色和创新包括片上三维光互连网络的光电并行体系结构、多业务流竞争网络资源的冲突树演算模型和应用对片上存储失效的高准确性预测模型。项目将提出片上光互连网络的光电并行双层体系结构，提出基于网络演算的三维片上网络性能分析和优化方法、提出基于访存行为模型和动态温度模型的三维共享存储划分机制和提出高可靠低开销的三维片上存储动态容错机制。

中文关键词： 微处理器；SoP；光互连；网络演算；缓存

英文摘要： The technology of high-performance microprocessors is an important foundation for national security and defense security. This project is aiming at the next generation mainstream architecture of the high-performance microprocessors in future ten to fifteen years. We will study the architecture of three dimensions (3D) optical interconnection network for the high-performance microprocessors based on System-on-Package (SoP) technology, the Network Calculus based analytical model and optimization method for the 3D interconnection network, and the on-chip 3D memory partition mechanism. There are three key scientific issues we will solve. Firstly, the multi-object optimization problem arisen from the design of high performance microprocessors interconnects, considering the power dissipation, bandwidth, chip area, reliability and so on. Secondly, the Network Calculus based conflict modeling technology introduced by the multi-traffic competing for network resource. Thirdly, the sensing mechanism of application program's memory access behavior. The features and innovations of the project include the on-chip 3D optical-electronic hybrid interconnection architecture, the conflict-tree calculus model of the multi-traffic competing for network resource and the high-precision predication model of the memory fault. In this pr

英文关键词： microprocessor；SoP；optical interconnection；network calculus；cache