We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors (~100 um) with electrodes having narrower size (~ 5 um) and reduced spacing (~ 30 um) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6-inch wafers.
翻译:我们报告为高液态LHC(HL-LHC)第2阶段升级开发新的3D像素传感器的情况。为了应对增加的像素颗粒(例如50x50或25x100m2像素大小)和极端辐射硬度(达到2e16毫克平方厘米的宽度)的要求,我们考虑了在高液态LHC(HL-LHC)升级的电极小(~5微米)和缩小间距(~30微米)的薄体3D传感器(~100微米),该文件涉及TCAD模拟,以及与这些3D传感器第一批有关的技术和设计方面,目前正在FBK6英寸长的瓦法上制造。