热固性聚酰亚胺树脂的共聚研究及其在电子封装中的应用

项目名称： 热固性聚酰亚胺树脂的共聚研究及其在电子封装中的应用

项目编号： No.50803026

项目类型： 青年科学基金项目

立项/批准年度： 2009

项目学科： 化学工业

项目作者： 刘峰

作者单位： 南昌大学

项目金额： 21万元

中文摘要： 活性封端的聚酰亚胺树脂由于具有耐高温、耐湿热等多种优良性能而被应用于制备航天飞行器的先进复合材料的基体树脂，但是由于它存在着熔点高、溶解性差、加工窗口窄、成型温度高等缺点，限制了更为广泛的用途。本项目试图利用活性溶剂与活性封端的聚酰亚胺共聚的方法研究提高热固性聚酰亚胺树脂的加工性，利用结构性能上具有柔性连接、具有大的取代基团的以及异构酰亚胺主链所赋予的良好的溶解性，聚酰亚胺树脂可以以较大的质量百分数与含有乙烯基的活性溶剂组成均相体系，该体系在辐照或者热引发的条件下可以发生共聚。该工艺的优点是降低了活性封端聚酰亚胺树脂的加工成型温度，无加工窗口的限制，加工过程中无溶剂挥发。该项目的难点和关键问题是寻求基于不同二酐单元和二胺单元结构的具有良好溶解性能的聚酰亚胺树脂以及如何平衡树脂加工性能与树脂综合性能的关系。该项目的研究对开辟聚酰亚胺树脂在电子封装领域的应用具有重要意义。

中文关键词： 热固性聚酰亚胺树脂；活性溶剂；共聚；电子封装

英文摘要： Reactive endcapped polyimide resins were used as advanced matrix resin of aircraft fortheir excellent thermal property and chemical resistance, however, drawbacks such as high melt points, poor solubility, narrow processing window and high processing temperature impeded further application of reactive endcapped polyimide. This project was intended for improving processability of thermosetting polyimide by way of copolymerization of thermosetting polyimide and reactive solvents bearing vinyl. Through introducing flexible linkage, bulky substituents and isomeric dianhydride moiety, thermosetting polyimide could be dissolved in reactive solvents bearing vinyl with high solid content. The resultant homogenous systems consisting of thermosetting polyimide and reactive solvent could be capable of copolymerizing via either irradiation initiation or thermal initiation. The advantage of this processing technique was lowered processing temperature of thermosetting polyimide, freedom from limitation of processing window and elimination of solvent release during processing. The key problem was to prepare thermosetting polyimide resin with good solubility based on selecting appropriate dianhydride and diamine moiety, and to balance the improved processability and compromised general property of polyimide resin in a degree. This project would help significantly advance the application of polyimide resin to electronic packaging.

英文关键词： thermosetting polyimide resin; reactive solvent; copolymeriztion; electronic packaging