项目名称: 超薄梯度Zr/ZrN自形成扩散阻挡层特性研究
项目编号: No.50871083
项目类型: 面上项目
立项/批准年度: 2009
项目学科: 建筑科学
项目作者: 宋忠孝
作者单位: 西安交通大学
项目金额: 34万元
中文摘要: 随着互连导线特征尺寸小于45nm,要求扩散阻挡层厚度低于3nm,目前常用的PVD技术已经不能满足需要,超薄高性能扩散阻挡层已经成为影响Cu互连使用可靠性的难点问题。本项目利用与Cu互连生产工序兼容的PVD技术沉积含氮的Cu(Zr)合金膜,通过退火形成超薄梯度Zr/ZrN自形成扩散阻挡层,改善Cu互连的可靠性。本项目首次提出应用高分辨透射电镜实时观察梯度自形成扩散阻挡层的形成和失效过程,结合梯度成分和显微结构的变化以及I-V测试结果研究该类扩散阻挡层的失效机理。本项目研究方法创新,研究结果具有较强的科学意义和工业应用价值。
中文关键词: 自形成;梯度;扩散阻挡层;
英文摘要: As development of 45 nm logic technology, the thickness of Cu diffusion barriers is required to be under 3 nm. PVD, which has been widely applied in integrated circuit technology, could not meet the compatible requirement of Cu interconnect correspondingly. In this case, ultra-thin Cu diffusion barriers become a big challenge for Cu interconnect stability. In this study, Cu(Zr) metallic layer was deposited by PVC methods, and untrl-thin gradient Zr/ZrN seif-assemble diffusion barriers were obtained by annealing Cu(Zr)/ZrN bilayer system in N2/H2 atmosphere. We observed the formation and degradation process of gradient self-assemble diffusion barriers by HRTEM, clarifying the degradation mechanism from a perspective of gradient components, microstructure and I-V properties relationships. This novel kind of diffusion barriers improve Cu interconnect stability effectively, providing advisable theoretical supporting as well as application model in industry.
英文关键词: Self-assemble; Gradiation; Diffusion Barriers;