基于钎料液态结构演变的钎焊界面反应机理研究

项目名称： 基于钎料液态结构演变的钎焊界面反应机理研究

项目编号： No.51301030

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 一般工业技术

项目作者： 赵宁

作者单位： 大连理工大学

项目金额： 25万元

中文摘要： 在电子封装技术中，钎焊界面反应是实现焊点可靠互连的基础科学问题。钎焊时钎料始终处于液相，其液态结构与界面反应存在强烈的相互作用。但传统界面反应理论忽略了液态钎料中合金元素通量对界面反应的影响，导致实际界面金属间化合物（IMC）生长行为与传统生长模型存在偏差，相关机理亟需深入研究。因此，本项目提出基于钎料液态结构演变探索钎焊界面反应机理的研究思路，主要通过高温X射线衍射技术在线研究钎焊过程中钎料的液态结构，获得Cu、Ag、Zn、Ni等主要合金元素在液态钎料中形成有序团簇的类型，明确有序团簇形成、尺寸和数量随成分和温度的变化规律，反馈液态钎料合金元素通量变化的信息，结合焊点界面IMC的生长行为，阐明钎料液态结构演变与界面反应的相关性，揭示钎料液态结构对界面IMC形核、生长和转变的作用机理。研究成果有助于丰富和发展钎焊界面反应理论，为通过调控有序团簇控制界面IMC形成与生长提供理论指导。

中文关键词： 微互连；界面反应；液态结构；金属间化合物；生长机制

英文摘要： In the process of electronic packaging, interfacial reaction during soldering is the basic science issue that can achieve reliable interconnect of solder joint. Since the solder is in liquid state all along during soldering, its liquid structure has strong interaction with the interfacial reaction. But the effect of flux of element from solder on interfacial reation is not included in the traditional theory of interfacial reaction. This causes the deviation between real growh behaviour of interfacial intermetallic compound (IMC) and traditional growth model. The related mechanism needs further study. Therefore, in this project, the research on mechanism of interfacial reaction during soldering is proposed based on liquid structure evolution of solder. The liquid structure of solders will be studied by using high-temperature X-ray diffraction technology, to obtain the type of ordered cluster formed from Cu, Ag, Zn and Ni in liquid solder, illustrate the change in form, size and amount of the ordered cluster with composition and temperature, and fed back the change information of flux of element from solder. By combining with the growth behaviour of interfacial IMC of the solder joint, the correlation between liquid structure evolution of solder and interfacial reaction during soldering will be clarified, and the

英文关键词： Micro interconnection；Interfacial reaction；Liquid structure；Intermetallic compound；Growth mechanism