功率LED芯片与热沉的焊料连接界面及服役效能研究

项目名称： 功率LED芯片与热沉的焊料连接界面及服役效能研究

项目编号： No.51301003

项目类型： 青年科学基金项目

立项/批准年度： 2014

项目学科： 一般工业技术

项目作者： 刘葳

作者单位： 北京大学

项目金额： 25万元

中文摘要： 针对半导体照明产业界的散热瓶颈关键技术问题，以芯片与热沉的特殊焊料连接界面为研究对象，研究大面积薄层金属/薄层焊料/薄层金属的键合反应及服役效能。本项目拟采用焊剂共晶技术或真空共晶技术，研究制程参数对界面微观组织结构和性能的影响规律，分析多层界面耦合反应和缺陷形成机制，项目预期目标将揭示焊料薄层界面连接的界面键合机制和相应键合模型。研究界面在力、电和热单场等多场耦合作用下，多层连接界面的微观组织结构和空洞的演化规律，分析多层反应耦合作用下界面的损伤规律和失效行为，建立界面的失效机制模型，提出延缓界面失效的有效途径。项目的研究成果对于进一步揭示研究金属薄层与焊料薄层的界面反应方面具有重要意义，为电子封装技术中高密度、微小尺度材料连接的设计和生产提供科学依据。

中文关键词： 功率LED；金属间化合物；固晶工艺；共晶焊；老化

英文摘要： solder bonding is the most promising die-attach process in high power LED packaging, which has lower thermal resistance and higher device reliability in comparision with the traditional insulation paste or silver paste die-attach processes. In this project, the eutectic bonding technology is studied with using flux or in the vacuum furnace, the detailed preparation process is investigated, and the interfacial reliability was evaluated. In this study, the large-scale industrialization of eutectic bonding would be expected to come true in the LED packaging industry of China. Firstly, the interfacial microstructure and phase distribution are investigated with different bonding processes, such as changing flux, bonding temperature & time, bonding force and so on. Secondly, the formation, evolution and growth behavior of interfacial voids are studied in details, and effective ways would be developed to reduce the interfacial void rate. Thirdly, under complex multi-field coupling environment, the interfacial damage features and failure mechanism of eutectic bonding are studied and the interfacial reliability can be evaluated, which provides the theoretical basis for the interfacial reliability design. Effective ways would be developed to postpone the interfacial failure behavior, and also to solve the device reliabili

英文关键词： Power LED；Intermetallic compounds；Die-attach process；Eutectic bonding；aging