新型微波介质陶瓷的高温介电响应及无线温度传感天线研究

项目名称： 新型微波介质陶瓷的高温介电响应及无线温度传感天线研究

项目编号： No.51472138

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 一般工业技术

项目作者： 岳振星

作者单位： 清华大学

项目金额： 83万元

中文摘要： 无源无线传感器是应用于恶劣环境下的物联网和无线传感网络的关键器件，而高灵敏度高温介质材料是无线温度传感天线的基础。本项目将面向无线温度传感应用，开展新型微波介质陶瓷的高温介电响应及无线温度重构天线的传感特性研究，重点研究介质材料中缺陷结构对高温损耗特性的影响机制，以及通过控制缺陷结构降低高温损耗、通过微结构控制提高温度敏感性的技术途径；基于新型低损耗介质材料，设计温度可重构介质天线，系统研究天线辐射特性和温度感知性能，确立天线特性与材料性能和天线结构之间的关系；发展出适用于无线温度传感应用的新型高温微波介质材料及高灵敏度无源无线温度传感天线。本研究将为新型无源无线温度传感天线的设计和应用奠定基础，开辟微波介质陶瓷材料新的应用领域。

中文关键词： 微波介质陶瓷；介电性能；微结构调控

英文摘要： Passive wireless sensors are the key devices for web of things and wireless sensing networks used in harsh environment. The high-temperature dielectric materials with high sensitivity are the basis for wireless temperature sensing antennas. This project will study on the dielectric response of microwave dielectric ceramics at high temperature and the sensing properties of wireless temperature reconfigured antennas for passive wireless temperature sensing applications. The effect mechanism of defect structures in dielectrics on dielectric dissipation at high temperature will be investigated in detail. The possible technical routes to decrease the high-temperature dielectric dissipation through defect control methods and to increase temperature sensitivity through microstructure control techniques will be also investigated. The novel type of wireless temperature sensing antennas will be designed on the basis of new low-loss dielectric materials and its radiation properties will be characterized detaliedly.The relationship between the behaviors of antenna and the properties of material will be established. New high-temperature microwave dielectric ceramics and high-senstitvity antennas will be developed for wireless temperature sensing applications.These studies will not only lay the foundation for the design and application of new passive wireless temperature sensing antennas but also open up the new application fields for microwave dielectric ceramics.

英文关键词： Microwave dielectric ceramics;Dielectric properties;Microstructure control