塑料光纤通信中650nm光电集成收发芯片的研究

项目名称： 塑料光纤通信中650nm光电集成收发芯片的研究

项目编号： No.61205060

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 信息四处

项目作者： 程翔

作者单位： 厦门大学

项目金额： 28万元

中文摘要： 塑料光纤（POF）通信是新一代短距离传输系统，具有简便、高速、低成本的优点，在光纤到桌面的宽带接入网、三网融合、智能家庭网络、工业控制等领域发挥重大作用。针对POF通信设备中最关键的核心- - 650nm光收发器技术掌握在国外的现状和分立的缺点，本项目提出采用0.5μm标准CMOS或BCD工艺实现650nm光电集成收发芯片的研究，重点解决光电子器件（RCLED、PD）与电路的集成技术。探讨光电器件等效电路模型的建立，解决光电集成电路协同设计的科学问题；提出采用键合（或倒装）技术的方法实现发射端的650nm RCLED与驱动电路混合集成；接收端中采用标准Si工艺直接实现高性能的650nm探测器和放大电路的单片集成。650nm收发芯片整体传输速率约250Mbps。该课题研究具有自主产权，在650nm波段上实现了Si集成电路工艺直接应用于光电子信息领域，对集成光电子学科的发展将起到推动作用。

中文关键词： 光电集成；塑料光纤通信；光发射芯片；光接收芯片；

英文摘要： As a new generation of short-distance transmission system, the plastic optical fiber (POF) communication with simple, fast and low-cost advantages is playing a major role in the fiber networking such as broadband access networks of fiber to the desktop, triple play, intelligent home networks, industrial control and other areas. The 650nm optical transceiver chips are regarded as the most critical core technology in the POF communications equipment, however they are foreign owned and discrete. In this project, we propose the reacher of 650nm optoelectronic integrated transceiver chip using a standard 0.5μm CMOS or BCD process，focusing on the integration of optoelectronic devices (RCLED and PD). Based on the optoelectronic device equivalent circuit model, the optoelectronic integrated circuit can be designed collaboratively. Bonding (or flip) technology will be used to the hybrid integrated circuit of a 650nm RCLED and a drive circuit in optical transmitter, monolithic optical receiver with an integrated photodiode and amplifier circuit will be developed in standard CMOS or BCD technology. The transmission rate of 650nm optoelectronic integrated transceiver is about 250Mbps.The research has independent property rights.The standard Si technology is applied directly in optoelectronic information field at the 650nm w

英文关键词： Optoelectronic integrated circuit；Plastic optical fiber communication；Optical transmitter chip；Optical receiver chip；