项目名称: 高速电路多维互连线信号完整性及3D场路特性研究
项目编号: No.61201082
项目类型: 青年科学基金项目
立项/批准年度: 2013
项目学科: 电子学与信息系统
项目作者: 张卉
作者单位: 中国传媒大学
项目金额: 25万元
中文摘要: 随着集成电路工作速率的提高,高速电路中互连线的分布参数效应对系统整体性能的影响不容忽视。现有的研究重点放在互连线单元的电路参数和传输性能上,而以电路整体作为研究对象的较少,即研究多层多导体电路中互连线间以及与封装结构的相互作用下系统内部场特性及外部路特性。基于此本课题开展以下研究:对高速电路中多维典型非均匀互连线及封装结构进行电磁建模,利用电磁场全波分析方法研究在超宽带脉冲信号激励下典型结构内部的场分布,分析研究结构内部电磁场的反射、辐射和耦合特性;根据各互连线输入输出信号波形以及时延的关系,研究多维互连线及封装对信号完整性的影响规律;应用广义传输线方程进行多维互连线结构和典型封装结构等效分布电路参数的提取,研究等效电路参数用于电路性能分析的方法和有效性.本课题的研究可将多维互连线和封装结构的各种物理效应统一到电路层面上来,使得高速电路的优化设计更加精确方便.
中文关键词: 高速电路;多维互连线;广义传输线方程;等效电路参数;
英文摘要: With the speed of integrated circuit increasing, in high-speed circuit, the distributed parameter effects of interconnect on the performance of the overall system can not be ignored. Existing researches focus more on the circuit parameters and the transmission performance of interconnect unit, less on the whole circuit: internal field distribution and external circuit characterastics of the system under the ineraction between the inerconnects, and between interconnect and packaging structure in the multi-dimensional circuit. Upon the requirements, the proposed project will carry out the following research works: by using full-wave electromagnetic analysis method, building electromagnetic simulation model of multi-dimensional typical non-uniform interconnect and packaging structures in the high-speed circuit, studying the field distribution inside the typical structures excited by the ultra-wideband pulse signal, and analizing the reflection, radiation and coupling characteristics of electromagenetic field inside the investigated structures. according to camparing the waveform and delay of signal at each interconnects' input port with that of signal at the interconnects' output port, studying the influence of multi-dimensional interconnects and packaging on the signal integtity. By using generalized transmission
英文关键词: High speed circuit;Multi-dimensional interconnects;Generalized transmission line equation;Equivalent circuit Parameters;