新型含有苯并环丁烯单体的合成及其发展可溶性高耐热绝缘聚酰亚胺/聚醚醚酮的方法研究

项目名称： 新型含有苯并环丁烯单体的合成及其发展可溶性高耐热绝缘聚酰亚胺/聚醚醚酮的方法研究

项目编号： No.21504103

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 数理科学和化学

项目作者： 孙晶

作者单位： 中国科学院上海有机化学研究所

项目金额： 23万元

中文摘要： 聚酰亚胺（PI）和聚醚醚酮（PEEK）是综合性能优越的高性能聚合物，也是重要的军用和民用材料。但其熔点高溶解性差，不易加工，限制了其应用范围。在其改性工作中，虽然许多方法能提高聚合物的溶解性，但往往以牺牲材料的耐热性为代价。也有研究将具有交联基团的共聚单体引入上述聚合物中，既提高了聚合物的溶解性，又能通过后聚合交联，使聚合物获得良好的热力学性能。然而，可交联的共聚单体的品种有限，并且有些改性效果不理想。鉴于苯并环丁烯的高反应活性，以其改性的聚合物具有良好的绝缘性和热稳定性的优点，本项目将利用我们最新发展的含有苯并环丁烯的双胺/双酚单体，将其引入PI和PEEK中，获得易加工高耐热的热固性聚合物。本项目将深入研究含有苯并环丁烯侧链的PI和PEEK的合成、性能和后聚合反应，进而发现性能优异的品种。开展本项目的研究，将为发展可溶性PI和PEEK提供新途径，并能获得加工性良好、高耐热绝缘的聚合物。

中文关键词： 热固性聚合物；高性能聚合物；苯并环丁烯；低介电常数

英文摘要： Polyimides (PI)s and Poly(ether ether ketone)s (PEEK)s are important high-performance materials utilized in military and civil fields due to their excellent overall properties. However, their high melt viscosity and poor solubilty in organic solvents leads to their deficiencies in processability, which limits their applications in many fields, such as microelectronics, light-emitting diodes and so on. Therefore, a considerable amount of structural modifications of polymers have been carried out to improve their solubility. Some approcoachs were proved to be sucessful to improve the solubility of the polymers, but their thermal stabilities and mechanical properties were usually scraficed. The strategy of introducing the cross-linkable groups to the copolymers as pendants can improve the solubility of the polymers, meawhile it can endow them good thermal stabilities and mechnical properties by postpolymerzation to convert them to cross-linking networks. However, few of momomers containing cross-linkable groups for development of PIs and PEEKs have been reported, and some of them can not give the polymers ideal overall properties. It is known that benzocyclobutene (BCB) is a molecule with high reactivity. BCB-functionalized oligomers or polymers can be readily converted to cross-linking matrixs at heating, which have been recognized as a new generation of high performance materials for microelectronic applications due to their excellent thermal stability and dielectric properites. The characteristic of BCB inspired us to develop a series of new monomers, which can be utilized to synthesize novel thermosetting PIs and PEEKs with good processability and high heat resistance. In this project, we will explore the synthesis, properties and postpolymerzation of the PIs and PEEKs containing BCB pendant groups to obtain the polymers with ideal overall properties. This research will provide a novel approach to develop solution-processable PIs and PEEKs to obtain excellent processability, thermal stabilities and dielectric properties.

英文关键词： thermosetting polymer;high performance polymer;benzocyclobutene;low dielectric constant