高温超导风力发电机中超导绕组及低温结构的设计基础研究

项目名称： 高温超导风力发电机中超导绕组及低温结构的设计基础研究

项目编号： No.51475257

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 机械、仪表工业

项目作者： 瞿体明

作者单位： 清华大学

项目金额： 83万元

中文摘要： 高可靠性、高功率密度、高效发电机组的开发一直是风电领域技术难题。随着高温超导（HTS）带材生产技术的发展和低温技术的日益成熟，利用高温超导技术突破传统风力发电机的性能极限已成为可能。本项目以兆瓦级全超导型同步风力发电机为应用目标，研究将HTS绕组用于励磁和电枢绕组的基本设计方法和关键技术要素，探索相关低温制冷结构的设计方法和准则；在此基础上开发15 kW级实验样机，为构建HTS绕组及低温结构的相关设计理论提供实验依据。通过本项目的顺利实施，拟研究HTS 绕组的多场跨尺度受力特征和结构设计方法、HTS绕组的热稳定性和失超传播机制、复杂多界面低温结构的热传导与大扭矩传递耦合机制等关键科学问题，力争在基础设计制造理论、实用化高温超导强电装备开发技术、青年骨干人才培养等多方面取得突破，为今后大功率高温超导风力发电机工程样机的开发奠定坚实的基础。

中文关键词： 高温超导绕组；低温结构；多界面；多场耦合；热稳定性

英文摘要： It is a great challenge to produce wind turbine generators with high power density, high reliability and high efficiency. The high temperature superconducting (HTS) technology makes it possible to produce novel wind generators beyond the power limit of tradition ones, thanks to the developing technology for the mass production of HTS materials and cryogenics. This project aims at the application of MW-class synchronous wind generators with a fully-superconducting structure. The fundamental design method and key technical issues of HTS windings for substituting of copper windings in both stator and rotor will be studied. Methods and rules for the design of the corresponding cooling structures will be explored. A 15 kW prototype model will be developed based on the above research work. Some key scientific problems, such as the complex multi-field and scale-span mechanical analysis and optimization design for HTS windings, the thermal stability and quench propagation mechanism of HTS coils, and the coupling mechanism between heat transfer and large torque transfer in multi-interface cryogenic structures, will be studied and solved. This project will become a firm step for the future MW-class industrial wind generators. It will certainly contribute to the basic theory and development technology of HTS devices for large scale applications. It can also help to build up an experienced young research team for HTS applications.

英文关键词： HTS winding;Cryogenic structure;Multi-interface;Multi-field coupling;Thermal stability