功率器件微互连非均质界面的热性能及宏-微观失效分析

项目名称： 功率器件微互连非均质界面的热性能及宏-微观失效分析

项目编号： No.11272192

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 数理科学和化学

项目作者： 张燕

作者单位： 上海大学

项目金额： 78万元

中文摘要： 针对功率器件高密度封装的微互连和有效散热要求，包含非均质填料互连材料的热传导性能明显优于单一填料情形。不同体积分数和颗粒配比形成的填料分布和各向异性特征，导致其内部微结构复杂性大为增加，互连界面尺度效应突出。本项目首先对非均质填料复合材料有效导热率进行实验测量和机理分析，实验制备测量得到系列样品完整数据表；建立更完善的有效导热率理论模型，考虑环氧基体与非均质填料的材料、微结构和尺度特征，尤其是不同类型填料配比在基体内的排列、传导特性等。分析非均质组合型填料颗粒在基体内的传导、不同材料间热阻，以及固化过程中基材非弹性行为对此复合材料整体导热性能的影响，得到适应功率芯片高效散热而研发互连材料的特征参数和传热性能的精细预测。同时，在高阶微极界面理论框架内引入内聚力模型，以描述界面内裂纹的萌生和发展，并与界面宏观变形耦合，建立宏-微观界面失效分析模型，以有限元实现并应用于功率器件互连可靠性分析。

中文关键词： 微互连；非均质；界面；传热；失效分析

英文摘要： Interconnect materials with inhomogeneous fillers show improved thermal conductivity in comparison with those with monomodal ones, and are more suitable for the interconnect and heat transfer in packaging with high-powered devices/components. The micro-structures in the joint matrix vary with different filler contents and distribution patterns, and become more complicated due to the types of particles involved and their anisotropy, showing obvious size effect in the interconnect. In this project, firstly experimental measurement and mechanism analysis will be carried out on the effective thermal conductivity of composite materials with inhomogeneous fillers. A complete data sheet will be obtained by systemic sample preparation and measurement. At the same time, a more comprehensive model will be developed to predict thermal conductivity of the composite material studied, and factors such as the matrix and filler materials, micro-structures and geometries as well as fillers' layout and conductivities will be included. Especially, the influences of heat transfer between bimodal filler particles, thermal resistance, and the shrinkage of epoxy resin during curing will be taken into consideration in the model establishment. Then a series of numerical simulations will be carried out on the characteristic parameters an

英文关键词： micro-interconnect；inhomogeneous；interface；heat transfer；failure analysis