基于超细纤维网络支架的导电高分子复合材料的构筑及其导电机理研究

项目名称： 基于超细纤维网络支架的导电高分子复合材料的构筑及其导电机理研究

项目编号： No.U1204507

项目类型： 联合基金项目

立项/批准年度： 2013

项目学科： 有机高分子材料学科

项目作者： 代坤

作者单位： 郑州大学

项目金额： 30万元

中文摘要： 导电高分子复合材料（Conductive Polymer Composites，CPCs）因在电器、电子、煤矿、化工等领域广泛应用而受到研究者普遍关注。常规方法制备的炭黑(CB)填充CPCs往往具有较高的绝缘体-导体转变含量(即逾渗值)，这极大限制了其应用。本项目拟利用表面官能化CB的分散液浸渍电纺尼龙6纤维膜，将CB粒子分布在超细纤维支架的表面预制导电薄膜，并以此薄膜做“芯”与上下两层聚乙烯膜按“三明治”结构复合，将复合膜破碎后熔融加工构筑三维导电网络，制备CPCs，拟显著降低CB填充CPCs的逾渗值。研究纤维尺寸、CB分布对CPCs微观结构、逾渗行为的影响；结合材料对温度、应力、有机溶剂等外场的响应规律，建立CPCs结构-外场-性能关系模型，揭示CPCs导电机理，并为其应用提供理论依据和试验基础。本项目为制备具有良好综合性能，且电性能受成型加工外场影响极小的CPCs提供了新思路。

中文关键词： 高分子复合材料；电性能；导电网络；经典纺丝；温度电阻行为

英文摘要： Conductive polymer composites (CPCs) have attracted many reseachers due to their popular applications in electric apparatus, electronics industry, coal industry, chemical industry, etc. Through traditional processing methods, carbon black (CB) filled CPCs always show high conductive filler concentration at the insulator-conductor transition region (i.e., percolation threshold region), which limits the application of CPCs greatly in many fields. In the present proposal, electrospun nylon 6 (PA6) non-woven fabrics will be soaked in the surface functionalized CB dispersion to prepare conductive network film by localizing CB particles on the surface of electrospun PA6 ultrathin fiber framework. Whereafter, sanwich-like compounded film with the conductive PA6 fabrics as the ‘core’ and two polyethylene films as “skin” will be prepared. The CPC will be prepared by melt mixing the pelletized sanwich-like film to construct a nice conductive network to lower the percolaton threshold. The influence of the size of fiber and the localization of CB particles on the microstructure and percolation behavior of the CPC will be studied; based on the response partten of the CPC in the thermal, mechanical, organic solvent fileds, the model for the relationships of structure-external field-properties of the CPC will be proposed, the

英文关键词： Polymer composites；Electrical properties；Conductive network；Electrospining；Temperature-resistivity behavior