低银无铅焊膏制备及板级封装部件跌落与振动焊点可靠性研究

项目名称： 低银无铅焊膏制备及板级封装部件跌落与振动焊点可靠性研究

项目编号： No.51275006

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 机械、仪表工业

项目作者： 雷永平

作者单位： 北京工业大学

项目金额： 80万元

中文摘要： 低Ag银无铅焊膏是电子产品无铅化和高密装连背景下提出的一类新型低成本封装材料。本项目将研制适合于低银无铅焊膏制备的膏状助焊剂和焊料粉体，解决低Ag焊料润湿性差和易氧化问题；针对板级封装典型焊点形态在跌落和振动条件下的失效问题，通过焊点断裂面积、电阻变化、电信号失真等参数的记录，运用比例风险模型分析输入加速度功率谱密度对不同形态焊点寿命分布的影响；重点探索低Ag板级封装焊点界面金属间化合物在跌落和振动下的失效机理，评定其失效过程中的能量耗损。 项目将采用试验型板级模板和实际产品板级部件进行跌落和振动试验，研究主控器件电信号失真和焊点电阻增加与焊点断裂面积之间的关系，企图建立一个基于能量准则并与现行可接受评判条件相关联的失效评定准则，为低Ag板级部件钎焊接头的可靠性评判提供理论指导，为低Ag无铅焊膏板级封装的工程可接受性评价提供技术支撑。具有重要的科学意义和应用前景。

中文关键词： 低Ag无铅焊膏；跌落与振动；失效机理；寿命分析；可靠性

英文摘要： Low Ag lead-free solder paste is a new type of low cost packaging materials under the background of lead-free electronic products and its high density situation. The project will be to develop a new paste flux for low-Ag lead-free solder and the solder powder in order to solve the poor wettability and oxidation for the low-Ag solder. According to the failures of typical solder joint shapes for board level package under the conditions of drop and vibration，by recording the fracture area in the joints, the change of joint resistance and electrical signal distortion parameters, the proportional hazard models will be used to analyze the influence of input acceleration power spectral density on the solder joint life distribution for different forms of joints. The emphasize well be focus on exploration the failure mechanism of interface intermetallic compounds for the joints of low-Ag board level packaging products during drop and vibration and evaluation the energy dissipation during failure process. The project will study the relationship between the increased joint resistance and the fracture area for attempting to establish an failure criterion based in energy loss, and the criterion associate with the acceptability judgment condition. The conclusion well provide a theoretical guidance for the reliability evalua

英文关键词： Low-Ag Lead-free Solder Paste；Drop and Vibration；Failure Mechanism；Life Analysis；Reliability