项目名称: 电解铜箔表面新型保护性膜材料的结构设计、合成及电化学防腐性能
项目编号: No.51263014
项目类型: 地区科学基金项目
立项/批准年度: 2013
项目学科: 一般工业技术
项目作者: 刘峰
作者单位: 南昌大学
项目金额: 50万元
中文摘要: 电解铜箔是微电子行业中重要的原材料,目前仍采用镀铬技术进行表面钝化处理。表面硅烷化是目前很有希望取代金属表面镀铬钝化处理的技术,但是由于电解铜箔在后续加工中经过了高温处理,因而需要对硅烷结构进行优化设计,制备高耐热的成膜材料。本项目拟利用江西本省的有机硅和可再生林产化学资源,通过D-A加成、烯烃羰基化、酰亚胺化、硅氢加成等反应制备一类新型的高耐热的有机硅结构改性聚酰亚胺材料,运用表面硅烷化技术对电解铜箔表面进行保护,通过相应的组分及结构组成设计,结合交流阻抗谱及动电位极化等技术,研究改性聚酰亚胺膜涂层的性能-结构关系,从而优化材料结构和成膜方法,探索研究对电解铜箔表面的无铬钝化保护。本项目将为铜箔表面的无铬钝化技术提供一条有益的思路,奠定一定的理论基础。本项目对于新型有机硅改性聚酰亚胺材料的合成方法学研究,以及有机硅单体和林产化学初级原料的高值转化途径研究,具有重要的理论价值。
中文关键词: 电解铜箔;有机硅改性聚酰亚胺材料;防腐性能;结构优化;
英文摘要: As an important raw material in microelectronics, electrolytic copper foil is easily eroded and currently protected by chromate electroplating technique, which nowadays is a very poisonous treatment approach to manual workers and the environment as well. Surface silanization is currently a promising chromate replacer for metal passivation technique. However,electrolytic copper foil is subjected to high-temperature processing during end-user fabrication, which requires the structural designing and optimization of silane to prepare the film-forming material with high thermal stability. This proposed project plans to synthesize a series of siloxane modified and alicyclic functionalized polyimide materials by way of D-A addition, olefin carbonylation, imidization, hydrosilylation, etc., starting from the raw materials of organoslicon and forestry resources in jiangxi province. Through monomer and polymer backbone structure designing, the target polyimide materials would be utilized to protect the copper foil by empolying the technique of surface silanizing. The protection efficiency of the siloxane modified polyimides on copper foil would be evaluated by the electrical impedence spectroscopy (EIS) and potentiodynamic polarization method. By studying the correlation of the structure of the protecting film coating mat
英文关键词: electrolytic copper foil;siloxane modified polyimide materials;corrosion protection properties;structure optimization;