标准CMOS工艺下单片三轴向地磁传感集成电路设计技术研究

项目名称： 标准CMOS工艺下单片三轴向地磁传感集成电路设计技术研究

项目编号： No.61204034

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 信息四处

项目作者： 刘珂

作者单位： 中国科学院微电子研究所

项目金额： 28万元

中文摘要： 集成地磁定位传感技术可广泛应用于物联网终端和便携式移动电子产品，利用这一技术制造的三轴向地磁传感集成电路主要包含霍尔传感器，信号检测与处理电路，和集成磁场集中器（Integrated Magnetic Concentrator, IMC）。现有技术无法将IMC与传感器、电路一起完全通过标准CMOS工艺实现，需借助特殊制造工艺。本项目以探索一套在标准CMOS工艺下完全实现三轴向地磁传感集成电路的设计方法为目标，围绕IMC的标准化工艺移植，通过建模分析，设计带有自校正的高动态、高精度磁电转换电路和微纳信号检测与处理电路，实现新制造方法下传感器、IMC器件和电路部分的单芯片系统集成，从而消除工艺误差、磁化效应、电路噪声、应力变化以及工作温度等非理想因素的干扰，达到定位精度的提升，从而降低生产成本、提高生产效率，使地磁定位技术具有更好的实用价值和推广潜力，促进智能传感网的发展。

中文关键词： 混合信号集成电路；定位传感；传感器；磁场；建模

英文摘要： The itegrated sensing technology for orientation within the earth magnetic field has been wildly used in IOT (Internet of Things) terminals and portable electronic devices. In this technology, the triple-axis sensing integrated circuit is composed of Hall devices, micro signal readout circuit, mixed-signal processing circuit, and Integrated Magnetic Concentrator (IMC). Traditional methods of implementation require specific design and producing processes which are not compatible with standard CMOS technology. The target of this proposal is to find a method of implementing the whole integrated circuit in standard CMOS technology. By the modeling analysis, a model which benefits solving the compatibility between producing IMC and CMOS processing would be obtained. At the same time, an optimized micro signal readout and processing circuit will be designed dedicatedly, which would get rid of processing error, perming effect, circuit noise, mechanical stress and temperature variation by calibration. It will result in high accuracy sensitivity according to a perfect system integration of all parts including sensor, circuits and IMC. Thus, through the research in this proposal, the method for integrated CMOS earth magnetic field sensor design and implementation would be concluded to reduce cost and increase efficiency i

英文关键词： Mixed-signal IC；Position-Sensing；Sensor；Magnetic Field；Modeling