湿热环境中电子封装环氧树脂吸湿及界面破坏机理的研究

项目名称： 湿热环境中电子封装环氧树脂吸湿及界面破坏机理的研究

项目编号： No.11472108

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 数理科学和化学

项目作者： 韩强

作者单位： 华南理工大学

项目金额： 90万元

中文摘要： 随着微/纳米电子元器件进一步的微型化和功能的高度集成化，湿气已经成为影响微电子封装及微系统可靠性的关键因素。目前，从分子量级描述湿气传输过程、扩散机理以及引起的材料损伤、界面破坏，研究工作仍然十分薄弱，无论从宏观连续介质力学的角度或微纳米力学的角度，这一领域的研究既不成熟也不系统。 本项目的研究目的旨在分子水平上揭示电子封装环氧树脂聚合物体系中湿气吸收、扩散、传输的基本规律；在微观尺度下提出一种新的建模方法，实现环氧树脂的三维网状交联，计及温度、湿度、交联度等因素的影响，系统研究湿热环境中湿气扩散所导致的环氧树脂力学性能劣化及破坏的基本机理；深入研究铜-自组装单分子膜(粘结剂)-环氧树脂界面的相互作用能及其变化规律，阐释影响界面开裂失效的主要因素，为粘结剂改性、选择和评价提供新的研究方法。研究工作对揭示聚合物体系的破坏机理及微/纳电子封装的湿致失效有着重要的学术价值和广泛的实际意义。

中文关键词： 环氧树脂；湿气扩散；界面破坏；分子动力学模拟；力学性能

英文摘要： With the further miniaturization and functional integration of the micro/nano electronic components, moisture has become a key factor in the reliability of microelectronic packaging and micro-system. However, at present, the mechanism of moisture diffusion and interface failure caused by moisture adsorption is not clearly described on molecular scale, neither with the continuum mechanics method nor the nano-mechanics method. In this project, the rules of moisture absorption and diffusion in epoxy resins of electronic package will be revealed. And a new algorithm will be developed for constructing the cross-linked molecular model of epoxy network using molecular dynamics simulation. The mechanical properties degradation and the failure mechanism of epoxy resin, caused by moisture diffusion, will be systematically investigated taking the temperature, cross-linked conversion and strain rate into account. Finally, the change of Cu-epoxy interfacial energy and the main factors affecting the interfacial damage will be indicated, which provide a new method of binder modification, selection and evaluation. This project has an important academic value and application value on the understanding of failure mechanism of epoxy systems and electronic packages caused by moisture adsorption.

英文关键词： epoxy resin;moisture diffusion;interface failure;molecular dynamics simulation;mechanical properties