项目名称: 碳纳米管TSV建模、热特性及电磁特性研究
项目编号: No.61474088
项目类型: 面上项目
立项/批准年度: 2015
项目学科: 无线电电子学、电信技术
项目作者: 丁瑞雪
作者单位: 西安电子科技大学
项目金额: 86万元
中文摘要: 三维集成电路技术就成为被用来解决缩短连线、多级集成、改善性能和降低功耗等问题的有效方法之一。本项目将研究三维集成电路中碳纳米管TSV的建模、电磁特性和热特性分析、微波、毫米波特性等内容。考虑碳纳米管束的长度、直径、碳纳米管的数量、金属化比例等因素,同时引入弹道运输特性,建立考虑热效应的碳纳米管束的解析模型。针对碳纳米管束TSV技术,考虑碳纳米管的动态电感、量子电容并结合其解析模型,建立考虑热效应的碳纳米管束TSV的解析模型。研究碳纳米管TSV隔离技术,用于优化混合碳纳米管的隔离度。研究几何结构参数和材料参数对碳纳米管TSV的微波、毫米波特性的影响,包括插入损耗、回波损耗、功耗、延时等。考虑碳纳米管TSV的横向和纵向热导率,研究碳纳米管热通孔密度优化分配技术。本项目的研究成果将为碳纳米管技术应用于未来三维集成电路设计提供必要的理论基础。
中文关键词: 三维集成;硅通孔;碳纳米管;热特性;电磁特性
英文摘要: 3D IC integration is an effective method which can reduce interconnect wire length, enable vertical integration, improve performance and reduce power consumption. In this project, we focus on the study of model, thermal analysis, electromagnetic characteristics in the carbon nanotube based through silicon vias in three-dimensional integrated circuits. Considering the length, diameter, ratio of the metal, and the number of carbon nanotube bundles, combine with ballistic transport properties, the analytical model carbon nanotube bundles considering heat effect is established. According to TSV technology, considering kinetic inductance, quantum capacitance of carbon nanotube bundles, the analytical model considering the thermal effect of carbon nanotube bundles based TSV is studied. TSV isolation technology which can improve the isolation between hybrid carbon nanotube is proposed. The effects of geometric parameters and material parameters on the electromagnetic characteristics of carbon nanotubes based TSV, such as insertion loss, return loss, power consumption, delay, etc., are also proposed. Considering horizontal and vertical thermal conductivity of carbon nanotubes, the floorplanning and placement of carbon nanotubes based thermal vias are completed. Our results will provide the necessary theoretical foundation of the application of carbon nanotube in 3D ICs integration.
英文关键词: 3D integration;Through silicon vias;Carbon nanotube;Thermal characteristions;electromagnetic properties