基于电催化反应Ni-W、Ni-Mo 提高Cr-Si高阻薄膜耐湿热性能研究

项目名称： 基于电催化反应Ni-W、Ni-Mo 提高Cr-Si高阻薄膜耐湿热性能研究

项目编号： No.61201038

项目类型： 青年科学基金项目

立项/批准年度： 2013

项目学科： 电子学与信息系统

项目作者： 王秀宇

作者单位： 天津大学

项目金额： 25万元

中文摘要： Cr-Si高阻膜在混合集成电路和薄膜器件应用方面非常重要。基于初步研究结果"Ni 的催化活性是Cr-Si-Ni高阻膜具有较好耐湿热性能的原因"并根据NiW和NiMo合金膜比Ni膜具有较好电催化性能的报道，通过设计的湿热实验采用CrSiNiW和CrSiNiMo靶材对磁控溅射沉积的Cr-Si-Ni-W和Cr-Si-Ni-Mo高阻合金膜的耐湿热性能进行研究，并与初步研究结果Cr-Si-Ni高阻膜的耐湿热性能进行比较，探索Cr-Si-Ni-W 和Cr-Si-Ni-Mo高阻薄膜是否较Cr-Si-Ni高阻膜具有更好的耐湿热性能，这对揭示Cr-Si高阻膜耐湿热性能与所含金属Ni、W、Mo 电催化性能之间的规律以及在Ni 发生电催化析氢反应的同时其他金属（如Cr）不发生电化学腐蚀反应的原因具有重要意义，为进一步提高含Cr-Si高阻膜的集成电路和薄膜器件的耐湿热性能及整机系统的可靠性提供新思路和理论依据。

中文关键词： Cr-Si 高阻薄膜；磁控溅射；耐湿热性能；电化学腐蚀；电催化反应

英文摘要： High-resistance Cr-Si film plays a particularly important role in hybrid integrated circuits and thin film devices. The research project will be carried out based on our preliminary findings that the catalytic activity of metal Ni may be the reason that Cr-Si-Ni film has good resistance to heat and humidity and the reports that NiW and NiMo alloy films have a better electrocatalytic performance than metal Ni film. In this project high-resistance Cr-Si-Ni-W and Cr-Si-Ni-Mo alloy films will be prepared by magnetron sputtering method using CrSiNiW and CrSiNiMo alloy targets and their properties will be studied by the designed heat and humid experiment. To find out that whether Cr-Si-Ni-W and Cr-Si-Ni-Mo resistive films have better resistance to heat and humidity than Cr-Si-Ni film in our preliminary findings, their properties of heat and humid resistance will be compared. It is significant to reveal the laws between the heat and humidity resistant performance of high-resistance Cr-Si film and the electrocatalytic performance of its contained metal Ni, W and Mo as well as the reasons that electrocatalytic reaction of Ni occurs while electrochemical corrosion of other metals such as metal Cr does not happen. This may provide new ideas and theoretical basis for further improving the heat and humidity resistant perform

英文关键词： High-resistanc Cr-Si thin film；Magnetron sputtering；Heat and humid resistance；Electrochemical corrosion；Electrocatalytic activity