高性能LED显示器件封装材料的关键科学问题研究

项目名称： 高性能LED显示器件封装材料的关键科学问题研究

项目编号： No.21274031

项目类型： 面上项目

立项/批准年度： 2013

项目学科： 数理科学和化学

项目作者： 余英丰

作者单位： 复旦大学

项目金额： 80万元

中文摘要： 发光二极管(LED)显示器件的封装材料需要高度的可靠性和稳定性，不但要具备耐高温、高透光、高折光率以及良好的界面粘接等基本性能，而且要满足低应力、耐湿热老化以及高耐候等性能要求。 申请人前期系统地进行了电子封装材料的湿热老化机理以及结构与性能的关系研究。最近研究发现：在调控环氧及改性剂刚柔组成、极性和交联密度的基础上，通过微纳米复合填充料改性环氧基体，基于片状微米粒子的湿气阻隔和纳米粒子的紫外屏蔽效应，极大地提高了高透光LED封装材料的耐老化性能。 本项目拟建立环氧封装材料的组成和结构与内应力及耐老化性能的联系，重点研究微纳米复合填充料对材料老化性能的影响。通过调整环氧、改性剂及催化剂的组成和材料固化转化率，明晰材料结构与光电及耐老化性能的关联性；调控纳米粒子与基体树脂组成，确定高透光微纳米复合填充体系的制备方法；通过研究不同的微纳米复合填充料体系，建立微纳米复合填充与耐老化性能间的联系。

中文关键词： LED 封装材料；环氧树脂；填料；老化机理；性能表征

英文摘要： High reliability and stability are the prerequisite for Light emitting diode (LED) packaging materials. Except high temperature resistance, high light transmittance, high light index of refraction and excellent interfacial bonding, epoxy encapsulation materials also have to fulfill the requirement of low internal stress, high hygrothemal stability and weatherability. In our previous works, the structure-property relationship and hygrothermal degradation mechanism of microelectronic packaging materials have been well studied. It has been found recently in our research that a combination of micro-sized flaky fillers and nanoparticles would dramatically enhance the moisture barring and ultraviolet shielding ability of the epoxy materials, furthermore, the properties of the LED packaging materials can be optimized by modulate the composition and structure of epoxy and modifiers, such as rigidity of main chain structure, polarity and crosslink density. The object of this project is to find the relationship of the thermal mechanical properties and anti-aging properties of epoxy encapsulation materials with their structure and composition by studying the interfacial bonding strength, internal stress, hygrothermal and UV aging of materials with different structure, curing stages, modifiers, and catalysts. The research w

英文关键词： LED packaging materials；epoxy resins；fillers；aging mechanism；property study