基于微腔耳语回廊模式多波长硅波导III-V半导体光发射芯片研究

项目名称： 基于微腔耳语回廊模式多波长硅波导III-V半导体光发射芯片研究

项目编号： No.61475151

项目类型： 面上项目

立项/批准年度： 2015

项目学科： 无线电电子学、电信技术

项目作者： 何平元

作者单位： 中国科学院半导体研究所

项目金额： 89万元

中文摘要： 光互连芯片有希望提供更快的传输容量以及更低的能耗。硅基片内光互联和光子集成回路的发展需要高效、稳定、可靠的光源。但是由于硅材料的间接带隙特性，光源问题一直以来都是阻碍这一领域进一步发展的瓶颈。本项目研究耳语回廊模式多波长硅波导III-V半导体光发射芯片的相关物理问题和设计制造技术，研究单片集成、耦合和封装所涉及的相关难点。具体研究激光模式损耗、硅基III-V微纳谐振腔激光器结构的设计与优化、III-V和硅集成系统的热稳定性问题和散热问题、以及混合集成多波长光发射芯片的光、电、微波测试方案。从而掌握光电子集成的关键制造和封装工艺，为高密度、大容量、低功耗的片上和片间光互连奠定基础。并以此为基础探索硅基波导与其他有源器件键合的可能性。为进一步拓宽片内光互联的功能，提高光子集成回路的集成度提供理论依据和技术准备。

中文关键词： 光发射芯片；硅光电子器件；多波长；耳语回廊

英文摘要： Chip optical interconnect provides faster transmission capacity and lower power consumption. The development of optical interconnect photonic integrated circuits requires efficient, stable and reliable light source based on silicon substrate. However, due to the indirect bandgap properties of silicon material, light bottleneck problem has always been hampered further development in this field. The project studies the multi-wavelength whispering gallery mode silicon waveguide III-V semiconductor light-emitting chip related physical problems and design and manufacturing technology, including monolithic integration, coupling and packaging etc. Specific research laser mode losses, the design and optimization of silicon-based III-V laser resonator structure, thermal stability and thermal issues of III-V and silicon integrated systems, as well as hybrid integrated multi-wavelength optical transmitter chip optical, electrical microwave test technology. It will provide useful theoretical and experimental support for further extending the functionality in the optical interconnection in silicon wafer and improving the degree of integration of photonic integrated circuits.

英文关键词： optical transmitter chip;Silicon-based Optoelectronic Device;Multi-wavelength;whispering gallery