之前分享Brett Simpson的AI芯片报告(“推荐一份AI芯片报告”),大家的反响不错。最近他们参与了AI Hardware Summit会议,形成了一些新的观点,这次第一时间呈现给大家。新报告题目是“AI Silicon: New Dawn for Compute”,从题目就可以看出作者非常看好AI芯片的前景。
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下面是这份报告的5个要点:
Five Key Takeaways from the AI Hardware Summit:
1) Almost all compute for accelerating AI at 7nm is made at TSMC. Also, we see a raft of new high-speed interface chips (Serdes 56/112GBs) scaling in ’19.
2) NVIDIA continues to be the king of training and will see widespread take-up for its new T4 card. We think it will remain a dominant player in ’19. Long-term, we remain concerned over AI relying less on CUDA and GPUs.
3) Intel has new 7nm chip (made at TSMC) for AI, we think supporting 112GBs Serdes and high-speed DRAM. It also should boost inference performance 11x with new DL Boost INT8 support in Cascade Lake servers next year.
4) All cloud players are developing in-house silicon, but the question is timing since plans to ramp are private. This vertical push is a major threat to chipmakers.
5) On a five-year view, we see advances in new analog computers (neuromorphic) with nanowires challenging parts of digital compute, silicon photonics replacing Serdes (beyond 112GBs) and higher speed memory driving AI performance gains.
再次声明,推荐这份报告并不代表我为其观点背书。大家如有问题或不同意见请直接和作者讨论。这次暂不翻译成中文了,如果需要大家可以留言反馈。
在公众号后台输入“报告”则可以获得下载链接。如果大家要分享给他人,请保证报告的完整性。
最后,祝大家国庆快乐!
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