Cyber-Physical Additive Manufacturing (AM) constructs a physical 3D object layer-by-layer according to its digital representation and has been vastly applied to fast prototyping and the manufacturing of functional end-products across fields. The computerization of traditional production processes propels these technological advancements; however, this also introduces new vulnerabilities, necessitating the study of cyberattacks on these systems. The AM Sabotage Attack is one kind of kinetic cyberattack that originates from the cyber domain and can eventually lead to physical damage, injury, or even death. By introducing inconspicuous yet damaging alterations in any specific process of the AM digital process chain, the attackers can compromise the structural integrity of a manufactured component in a manner that is invisible to a human observer. If the manufactured objects are critical for their system, those attacks can even compromise the whole system's structural integrity and pose a severe safety risk to its users. For example, an inconspicuous void (less than 1 mm in dimension) placed in the 3D design of a tensile test specimen can reduce its yield load by 14%. However, security studies primarily focus on securing digital assets, overlooking the fact that AM systems are CPSs.
翻译:计算机化传统生产工艺推动了这些技术进步;然而,这也带来了新的脆弱性,使得有必要对这些系统进行网络攻击的研究。AM 破坏性攻击是源于网络域的一种动脉式网络攻击,最终可能导致物质损害、伤害甚至死亡。攻击者根据数字形式,对AM数字过程的任何具体过程进行不明显但具有破坏性的改变,从而大大地应用于快速原型和生产功能终端产品。传统生产工艺的计算机化可以推动这些技术进步;然而,这也带来了新的脆弱性,使得有必要对这些系统进行网络攻击。AM 破坏性攻击是一种动能性网络攻击,这种攻击起源于网络域,最终可能导致物质损害、伤害甚至死亡。攻击者可以通过对AM数字过程链的任何特定过程进行不明显但具有破坏性的改变,从而以人类观察者看不到的方式损害制成品的结构完整性。如果制造的物体对其系统至关重要,这些攻击甚至可能损害整个系统的结构完整性,对其用户构成严重的安全风险。例如,在3D设计中置于不明显真空(尺寸小于1毫米)的抗体测试标本中,其产量可减少14 %。然而,安全研究主要侧重于保护数字资产系统。